Lead Mechanical Design Engineer - PCB

Honeywell Aerospace•San Diego, CA

3h•$143,000 - $180,000•Onsite

About The Position

As a Lead Mechanical Design Engineer at Honeywell Aerospace-EDS, you will contribute to the design and development of complex integrated RF/high-speed printed circuit board layouts and advanced electronic packaging. You will use mechanical and PCB design principles, ECAD software, and other design tools to oversee design work and support innovative, high-performance electronic solutions. The position is based at the company’s San Diego location and reports to the Senior Manager of Design Engineering. The role performs independent design and layout tasks for moderate- to highly-complex integrated RF/high-speed layouts; generates and revises detailed fabrication and assembly drawings; and incorporates engineering change orders. Work follows company design guidelines, industry standards, and established PCB design practices. You will also contribute design modifications that improve CCA quality or facilitate PCB manufacturing, and support a strong, diverse, inclusive team through recruiting, talent development, retention, and engagement activities. Honeywell Aerospace-EDS develops electromagnetic defense products, including radar, electronic warfare, and threat-detection technologies. Due to U.S. export-control requirements, candidates must be U.S. persons, as defined in the posting.

Requirements

Bachelor’s degree from an accredited institution in a technical discipline such as science, technology, engineering, or mathematics.
Eight or more years of related experience designing high-frequency products using multilayer mixed-mode SMT and chip-and-wire (MIC) design approaches.
Degree in electrical/electronics engineering or equivalent experience in schematic creation and electro-mechanical layout design; an associate degree in Design Drafting with directly related experience and a proven design history is acceptable.
Strong knowledge of electronics packaging.
Understanding of metal fabrication, electronics assembly, and electronics manufacturing flow.
Comprehensive knowledge of ASME Y14.5 and related drawing specifications.
Comprehensive knowledge of ASME Y14.100 and related drawing specifications.
Expertise in dimensioning and tolerancing and strong working knowledge of GD&T.
Comprehensive knowledge of the IPC 2220 series of standards associated with CCA and PCB design.
Ability to review and compare engineering inputs and drawings, identify inconsistencies, and determine when corrections are needed.
Ability to work effectively as part of an integrated design team and adapt to changing priorities and assignments.
Ability to present information and speak effectively, and to communicate across organizational levels with quality, integrity, and respect.
Ability to use computer-aided design software suites including Xpedition, Altium, and/or PADS.
Ability to use common MS Office software and enterprise information systems such as SAP, Teamcenter, or Agile.
Ability to perform design validation and testing to ensure circuit functionality.
Ability to optimize PCB layouts for performance, reliability, and manufacturability.
Understanding of manufacturing processes and design-for-manufacturability (DFM) principles.
Ability to translate 2D/3D data into circuit elements for library creation and mechanical integration.
Ability to generate full CAM and fabrication documentation.
Must be a U.S. person: a U.S. citizen, U.S. permanent resident, or person with protected status in the U.S. under asylum or refugee status.

Nice To Haves

IPC CID+ certification.
Formalized ECAD software training from an accredited source.
Knowledge of MIC (Microwave Integrated Circuit) design, packaging, and processes.
Experience in microwave or millimeter-wave electronics packaging design.
Experience with mixed-mode, multilayer PCB design.
Experience with SAP ERP and Oracle Agile PLM; Teamcenter is a plus.
Strong knowledge of PCB fabrication and assembly processes.
Experience working with outside vendors during PCB design and assembly to ensure design feasibility and product quality.
Knowledge of Siemens ECAD/MCAD tool sets, such as Xpedition Flow, NX modeling, and Valor NPI.
Experience with Altium Designer, PADS Standard Plus Layout, and Logic.
Experience with 2D AutoCAD and 3D modeling software such as SolidWorks, Creo, or NX.

Responsibilities

Generate circuit layouts and drawings from engineering inputs, including schematics, block diagrams, and flow charts.
Incorporate engineering change orders into designs using Xpedition, Altium, or PADS for ECAD; AutoCAD for 2D; and Siemens NX or SolidWorks for MCAD.
Recommend component hardware, printed circuit board material, tooling, and metal material selections.
Prepare parts lists and enter parts-list data into PLM systems such as Agile and Teamcenter.
Interface with Engineering to define mechanical assembly approaches for manufacturing and production.
Understand and support basic engineering calculations for line impedance, temperature rise, and voltage drop in RF and DC circuits.
Comply with company safety policies and practices.
Participate in Lean/Six Sigma activities in the work area and other areas to support cross-functional problem solving.
Collaborate in team meetings and activities.
Perform other job-related duties supporting the engineering department.
Perform independent design and layout tasks for moderate- to highly-complex integrated RF/high-speed layouts.
Generate and revise detailed fabrication and assembly drawings from layouts and engineering change orders.
Contribute design modifications to improve CCA quality or facilitate PCB manufacturing.
As a people leader, help recruit talent, identify and develop successors, drive retention and engagement, and foster an inclusive culture.
Conduct design reviews and present designs to internal design review members.
Perform design validation and testing to ensure circuit functionality.
Maintain and seek up-to-date knowledge of industry standards and technology trends.