Lead Hardware System Architect

Bolt Graphics•Sunnyvale, CA

2d•$200,000 - $250,000•Onsite

About The Position

As the Lead Hardware System Architect, you will own the end-to-end hardware development lifecycle for our next-generation graphics compute platforms, high-performance GPU servers, and ultra-high-speed PCIe graphics form factors. You will act as the technical bridge between advanced graphics silicon packaging and system-level deployment, driving physical architecture, functional partitioning, and high-speed fabric optimization for massive graphics workloads and real-time rendering infrastructure. In this role, you will not just oversee board layouts; you will define the physical topologies that enable cutting-edge graphics compute scaling. You will serve as the ultimate technical escalation point for our global JDM/ODM engineering partners, steering them through complex bring-up, signal integrity boundaries, and root-cause failure analysis to deliver flawless graphics hardware on schedule. This role is on-site, 5 days a week.

Requirements

Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related technical discipline.
8+ years of hardware design experience, with a proven track record of shipping high-performance graphics hardware, GPU motherboards, or high-density parallel compute accelerator boards.
Deep, hands-on experience designing with PCIe Gen 5/6 and high-speed serdes (112G/224G PAM4 architectures).
Strong understanding of high-frequency PCB layout constraints, via optimization, and power delivery networks capable of handling extreme di/dt step loads inherent to dynamic graphics workloads.
Proficiency with advanced EDA tools (e.g., Cadence Allegro, OrCAD) and familiarity with simulation tools for validating physical design assumptions.
Experience directing overseas ODM engineering teams through architectural definition, layout execution, and laboratory hardware triage.

Nice To Haves

Familiarity with CXL or scalable interconnect fabrics is highly desired.
Direct experience with Open Compute Project (OCP) standards or industry-standard multi-GPU form factors.
Familiarity with liquid cooling or advanced phase-change thermal infrastructure and its unique spatial and material constraints on physical board design.
Hands-on lab experience utilizing high-speed validation equipment (e.g., oscilloscopes, VNAs, BERTs) for signal and power verification on graphics hardware.

Responsibilities

Architect the Platform: Drive system-level architectural trade-offs, balancing high-performance GPU silicon package constraints, high-speed routing density, thermal mechanics, and ultra-high-density power delivery networks (PDNs).
Own High-Speed Topologies: Design and optimize complex PCB topologies utilizing PCIe Gen 5/Gen 6 (CEM specifications) and proprietary/consortium scale-up interconnect fabrics designed for parallel compute and graphics scaling (e.g., NVLink, Infinity Fabric, UA Link).
Systemic Co-Design: Collaborate with Silicon, Signal/Power Integrity (SI/PI), and Thermal/Mechanical teams to define robust board stack-ups, low-loss material selection, and multi-phase power zones handling massive transient loads from modern graphics processors.
Management Integration: Ensure seamless integration of out-of-band telemetry and management infrastructure, designing physical routing for Baseboard Management Controllers (BMCs), SPI, and I2C/SMBus topologies.
Lead Technical Enablement: Serve as the primary technical authority interfacing with international JDM/ODM layout and hardware engineering teams.
Triage & Failure Analysis: Lead complex hardware debug, component-level troubleshooting, and failure analysis (FA) during early-phase platform bring-up and validation of graphics compute hardware.
DFX & Execution Governance: Enforce rigorous design reviews and strict compliance with DFX (Manufacturing, Assembly, Test, and Automation) standards to ensure high-yield transitions from EVT/DVT to High-Volume Manufacturing (HVM).