Junior Packaging Engineer
About The Position
MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks. MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates. Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!
Requirements
- BS in Mechanical Engineering, Materials Science, or related field
- Experience with solving steady state and dynamic thermal and mechanical problems, using finite element analysis (FEA) and computational fluid dynamics (CFD) software
- Experience with AutoCAD is desired
- Ability to work effectively on multiple projects at a time
- Good written and verbal communication skills. Able to present ideas, design concepts, data and plans at team meetings
- Good teamwork skills in working together to achieve goals
- Basic understanding and use of statistical techniques such as DOE and SPC.
Nice To Haves
- Experience with IC package design and process development, with emphasis on RF and Microwave IC’s, is a plus
- Basic knowledge of high-volume RFIC and Microwave IC assembly processes (die attach, flip chip, wafer saw, wire bond, surface mount, package singulation, etc.) is a plus
- Understanding of relationship between materials and package performance is a plus
- Experience in failure analysis methodology is a plus
Responsibilities
- Provide technical support for RF/microwave plastic, ceramic, and metal packages along with pallets
- Work with internal product design, QA, Reliability, Failure Analysis, supply chain, and the external suppliers to develop and apply and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and quality
- Provide thermal and mechanical modeling for new packages and for improving existing package designs
- Update design rules for packaging as required
- Participate in and contribute to assembly process development internally and at our contract manufacturers
- Participate in troubleshooting IC packaging defects, then define and implement solutions
Benefits
- Health, dental, and vision insurance.
- Employer-sponsored 401(k) plan.
- Paid time off.
- Professional development opportunities.
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
What This Job Offers
Job Type
Full-time
Career Level
Entry Level
