Intern - Wafer Bonding Process Development

Micron Technology • Boise, ID

1d • Onsite

About The Position

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. The Technology Development (R&D) organization is responsible for developing innovative memory and storage technologies that enable next-generation semiconductor products. The Wafer Bonding team focuses on advancing wafer bonding processes and equipment, driving technology acceleration, manufacturability, and performance improvements through research, experimentation, and collaboration across engineering fields. As a Wafer Bonding Process Development Intern based in Boise, Idaho, you will contribute to the research, development, and optimization of advanced wafer bonding technologies that support future semiconductor products. Working alongside experienced engineers and researchers, you will design and execute experiments, evaluate new process solutions and equipment, and analyze data to improve process performance, yield, quality, and manufacturability. This internship offers a chance to apply scientific and engineering principles in a modern R&D environment. It involves using Artificial Intelligence (AI) tools and advanced analytics to speed up learning, process development, and innovation.

Requirements

• Currently pursuing an MS or PhD in Chemical Engineering, Chemistry, Materials Science, Electrical Engineering, or a related technical field.
• Demonstrated understanding of wafer bonding principles and semiconductor processing applications.
• Research, laboratory, internship, or project experience in a semiconductor-related field.
• Working knowledge of statistics, mathematical analysis, and experimental design methodologies.
• Strong written, verbal, and presentation skills with the ability to communicate technical concepts effectively.

Nice To Haves

• Experience analyzing semiconductor process data using statistical methods and data visualization techniques.
• Knowledge of machine learning algorithms and their application to engineering or process development problems.
• Experience applying Artificial Intelligence (AI) tools or AI-Assisted workflows to enhance technical research, data analysis, or productivity.
• Proven ability to work independently and collaboratively in a dynamic, fast-paced research environment.
• Strong problem-solving skills with attention to detail and a focus on achieving outcomes.

Responsibilities

• Support the research and development of manufacturable wafer bonding technologies for next-generation semiconductor devices.
• Plan, execute, and analyze experiments; communicate findings through clear technical reports and presentations.
• Identify and implement process improvements to enhance yield, quality, cycle time, and manufacturing readiness.
• Evaluate new wafer bonding equipment, materials, and process solutions through structured characterization and data analysis.
• Leverage approved Artificial Intelligence (AI) and AI-Enabled tools to improve productivity, accelerate learning, and support process development activities.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Career Level: Intern