Intern - Process Development Engineer, Planar DRAM CMP

Micron Technology • Boise, ID

3d

About The Position

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's Chemical Mechanical Polishing (CMP) Process Group focuses on evaluating next-generation hardware platforms and process chemistries that enable future semiconductor technology nodes. The team performs fundamental research, chemistry development, and process characterization to support the advancement of integrated circuit manufacturing. Through close collaboration with engineering and research teams, the group drives innovation in process capability, productivity, and manufacturing excellence. In this role, you will work alongside Micron engineers and scientists to develop and optimize CMP processes that meet device performance requirements for future technology generations. You will help build new processes and support continuous improvement by using experimentation, data analysis, and characterization techniques. You will apply AI-enabled tools to develop better research and development outcomes.

Requirements

• Currently pursuing an M.S. or Ph.D. in Chemical Engineering, Chemistry, Materials Science, or a related STEM field, with an expected graduation date after September 2027.
• Demonstrated academic or research experience in a STEM field with strong verbal and written communication skills.
• Ability to work independently with minimal supervision while managing multiple priorities and deadlines.
• Experience creating technical presentations, reports, and research documentation.
• Working knowledge of at least one of the following areas: organic chemistry, inorganic chemistry, surface chemistry, electrochemistry, or materials science.

Nice To Haves

• Knowledge of integrated circuit processing, semiconductor manufacturing, and semiconductor device fundamentals.
• Prior experience with Chemical Mechanical Polishing (CMP) processes, equipment, or research activities.
• Experience applying AI, Generative AI, AI Assistant, or AI-supported tools such as Microsoft Copilot to improve analysis, documentation, or research productivity.
• Experience building, evaluating, or utilizing AI-enabled applications, agents, or Large Language Models (LLMs) in research or engineering environments.
• Demonstrated ability to work effectively in both individual and team-based technical settings.

Responsibilities

• Collaborate with engineering teams to develop and evaluate CMP processes, chemistries, and hardware platforms for future semiconductor technology nodes.
• Conduct fundamental research, process characterization, and data analysis to support process development and optimization activities.
• Assist with projects focused on improving process capability, productivity, efficiency, contamination control, and surface/interface characterization.
• Utilize AI-enabled and AI-assisted tools to analyze experimental data, improve workflow efficiency, and support process development decisions.
• Prepare and present technical reports, experimental results, and recommendations to engineering and research teams.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Intern