About The Position

Ayar Labs is hiring a graduate intern for its Optical Packaging team, which develops fiber-to-chip interfaces, optical connectors, and assembly processes for the company’s optical I/O chiplets. The intern will analyze optical test data from these interfaces and use it to inform engineering decisions. The work involves insertion-loss and coupling measurements from components, wafers, packaged parts, and supplier data, with the goal of isolating variation sources and identifying component and assembly factors that drive coupling loss. The role combines hands-on laboratory measurement with statistical analysis in Python. Projects will be scoped to the intern’s background and interests. The intern will be mentored by the Optical Packaging team and work alongside test, characterization, and process engineers. The position is on-site in Ayar Labs’ San Jose office for a term from May to August 2027. No immigration support is available except for F1, and relocation support is not provided.

Requirements

  • Coursework or research in photonics or optics, including fiber optics and fiber-to-chip coupling.
  • Hands-on laboratory experience with optical insertion-loss or fiber-optic measurements.
  • Comfort using optical test equipment such as laser sources, power meters, and optical switches.
  • Proficiency in Python for data analysis and statistics, such as Pandas, NumPy, and SciPy.
  • Ability to clean, merge, and analyze large measurement datasets while tracing results back to devices and test conditions.
  • Actively pursuing a Master’s or PhD degree in Optical/Photonics Engineering, Electrical Engineering, or Applied Physics.

Nice To Haves

  • Experience with design of experiments, variance analysis such as ANOVA, or measurement system analysis.
  • Familiarity with SQL or other structured data sources.

Responsibilities

  • Take optical measurements, including insertion loss and return loss, on fiber arrays, optical connectors, and packaged photonic interfaces using team test stations.
  • Correlate component-, wafer-level, and package-level measurements to identify where coupling loss is introduced during the build.
  • Compare optical performance across builds and supplier lots.
  • Build reproducible Python analyses and plots that the team can rerun as new data arrives.
  • Document methods and present results to the Optical Packaging team at the end of the internship.
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