Integration Engineer - BCD Technology
About The Position
onsemi is seeking a Technology BCD Integration Engineer in our Hopewell Junction, NY, site. Engineers on this team work across device, process, and integration disciplines to deliver advanced BCD technologies from concept through qualification and readiness for volume manufacturing. In addition to driving new technology development, team members are responsible for ensuring the technology is robust, manufacturable, and production‑ready, including yield learning, reliability, process window definition, tooling readiness, defectivity control, and managing complex interactions across highly coupled process flows that often span multiple modules and stakeholders. You’ll thrive in this role if you enjoy working at the intersection of technology development and manufacturing readiness, are comfortable navigating trade‑offs across integrated device and process modules, and take ownership of driving complex technical issues to closure in an advanced manufacturing environment. This role sits at the critical intersection between technology development and manufacturing readiness. The work you do directly determines whether new BCD platforms successfully transition from promising concepts into reliable, scalable technologies that enable next‑generation products across power, automotive, industrial, and imaging markets. Strong execution in this role accelerates time‑to‑market, reduces downstream risk, and sets the foundation for success at onsemi’s most advanced fab.
Requirements
- BS or higher degree in Engineering or Materials Science
- 2-4 years or more of relevant experience in semiconductor manufacturing integration and technology development.
- Familiar with 5S, 8D, 6-sigma, SPC, DOE, FMEA
- Demonstrated experience with back‑end‑of‑line (BEOL) process integration, including areas such as MIM capacitors, copper metallization, CMP, dielectric integration, or related BEOL modules.
- Familiarity with post‑fab process considerations (e.g., probe, backgrind, backside metallization, or packaging interfaces) as they relate to technology qualification and manufacturability.
- Strong technical judgment and ability to drive complex, cross‑module integration decisions with limited precedent.
- Experience working in or alongside advanced 300 mm semiconductor manufacturing environments.
Responsibilities
- Driving high‑voltage BCD platform enhancements from development through qualification and manufacturing readiness.
- Integrating embedded non‑volatile memory modules into an established BCD technology.
- Enabling ROIC‑optimized process flows and advanced capacitor (MIM) options, including integration and manufacturability trade‑offs within a complex BEOL stack.
- Developing low‑power and low‑noise CMOS options to improve performance in sensitive analog and imaging applications.
- Improving DMOS performance and reliability through targeted device and process integration changes, with emphasis on qualification and manufacturability.
- Supporting packaging and post‑fab readiness using standardized test vehicles to accelerate technology qualification.
Benefits
- Competitive benefits package
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
