Integrated Photonics Engineer

Azora•Phoenix, AZ

1d•$125,000 - $185,000•Onsite

About The Position

Develop the photonic integrated circuit (PIC) technology at the heart of Azora's high-sensitivity optical transceivers. You will design, simulate, and characterize integrated photonic devices and modules; shepherding them from foundry tape-out through packaging and system integration.

Requirements

MS/PhD in Photonics, Electrical Engineering, Applied Physics, or related field (or equivalent industry experience).
3+ years of hands-on PIC design and characterization experience.
Proficiency with photonic simulation and layout tools (Lumerical, Synopsys, KLayout, IPKISS, or similar).
Experience with at least one commercial foundry PDK and tape-out cycle.
Strong lab skills: fiber alignment, RF probing, optical test instrumentation (OSA, LCA, tunable lasers).

Nice To Haves

Experience with coherent optical communications (DP-QPSK/QAM, DSP-based receivers) and/or photon-counting detection.
Familiarity with free-space-to-chip coupling, optical phased arrays, or integrated beam steering.
Knowledge of space qualification of photonic components (radiation, TVAC, vibration).
Experience with hybrid integration (III-V on Si, micro-transfer printing) or co-packaged optics.

Responsibilities

Design and simulate integrated photonic components and circuits: waveguides, couplers, 90° hybrids, MZI modulators, phase shifters, photodetector interfaces, and on-chip filters.
Own foundry tape-outs on silicon photonics, SiN, or InP platforms, including DRC, layout, and process design kit (PDK) workflows.
Develop test plans and carry out wafer- and chip-level characterization: insertion loss, polarization behavior, bandwidth, responsivity, and phase noise.
Work with packaging partners on fiber attach, hermetic packaging, and co-packaging with electronics for space environments.
Integrate PICs into coherent and photon-counting receiver chains and validate end-to-end sensitivity against quantum-limit targets.
Assess radiation tolerance and thermal behavior of photonic devices for flight applications.
Collaborate with mixed-signal and FPGA engineers on driver/TIA interfaces and DSP requirements.