Integrated Photonics Design Engineer, CPO PDK

HyperLightCambridge, MA
Onsite

About The Position

HyperLight is a company at the forefront of commercializing thin-film lithium niobate (TFLN) integrated photonics, a technology enabling high-performance optical components for AI/datacom infrastructure, hyperscale computing, quantum computing, and sensing. The company has developed the TFLN Chiplet™ platform, designed for scalability and manufacturability. HyperLight partners with customers and suppliers from conceptualization through mass production. The company is seeking an Integrated Photonics Design Engineer, at Senior or Staff level, to lead process design kit (PDK) development for their co-packaged optics product line. This role involves close collaboration with internal teams and external partners to drive PDK development and ensure rapid time-to-market. The engineer will be involved in product-related discussions and decisions impacting the business.

Requirements

  • Either 5+ years of relevant work experience or equivalent experience through an advanced degree (M.S. or Ph.D.) in Electrical Engineering, Physics, or a related field.
  • Strong expertise with passive and/or active photonic device component design, including hands-on development of multiple successful designs.
  • Strong expertise in finite element analysis of PIC components using tools like Lumerical, Tidy3D, COMSOL, Synopsys OptoDesigner, etc.
  • Extensive hands-on experience performing measurements to characterize photonic integrated circuits using instruments like swept lasers, fiber alignment stages, VNAs, BERTs, oscilloscopes, etc.
  • Extensive experience with data analysis and statistical methods such as design of experiments using tools like JMP or Python.
  • Demonstrated record of innovation and achievement, e.g. product designs, publications, or patents.
  • Familiarity with the entire PIC engineering process, including simulation, layout, fabrication, test, and device operation.
  • Excellent organizational and communication skills
  • Comfortable working with cross-disciplinary teams
  • Authorization to work in the US is required.

Responsibilities

  • Collaborate with our product team, foundries, and customers to define device component and fabrication process performance requirements for co-packaged optics applications
  • Lead the end-to-end design and validation of high performance device components, in collaboration with other component designers and process engineers
  • Own and maintain the process design kit (PDK) for our co-packaged optics platform
  • Contribute to the development of design, layout and verification enablement toolsets in open source and commercial tools including GDSFactory, Cadence Virtuoso, Synopsys Optocompiler and ICV, and Siemens Calibre.

Benefits

  • Competitive market-based compensation (Salary range $150,000 - $225,000)
  • Comprehensive health coverage, including medical, vision, and dental plans for individuals and families
  • 401(k) retirement plans with employee matching
  • Paid Parental Leave
  • Life and disability insurance
  • Commuter benefits and subsidies
  • Professional growth and mentorship opportunities
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