The Fabrication Engineering Group provides rapid fabrication, assembly, integration, and testing of advanced hardware prototypes for national security applications. Examples include the precision machining fiber mounts for airborne high-energy laser systems, multi-functional structures using additive processes for ground-based radar systems, custom printed circuit boards (PCBs) for space-borne data processing, and highly integrated mechanical packaging for undersea communication terminals. Core mechanical competencies span precision fabrication, additive manufacturing, and 5-axis machining. The group concentrates on high-complexity parts, quick-turn capabilities, and activities that require concurrent engineering with program teams. Core PCB capabilities include design for manufacturability (DFM), automated solder paste dispensers, precise pick-n-place machines, and automated optical inspection systems. Assembly, integration, and test capabilities include integration spaces, clean rooms, vibration testing, thermal testing, and space simulation chambers. The Group focuses on state-of-the-art prototyping capabilities, technical excellence, exceptional collaboration, and outstanding operation. An Electronic Inspector B is capable of working with some supervision, following quality control procedures to validate as-received commercial off the shelf and semi-custom electronic and mechanical parts. Due to the prototyping nature of work at Lincoln Laboratory, a wide range of parts flow through the incoming inspection area and each category has a unique set of inspection parameters. An ideal inspector for this role will have a good attention to detail, reading comprehension, communication skills, and comfort handling parts ranging from threaded fasteners to connectors and lead formed electronic components. Procedures are in place for each part type and an inspector must reference a variety of documentation including datasheets, goods receipts, engineering instructions, drawings, etc. Inspection items include mechanical dimensions, XRF for material analysis, component value measurement, bare printed circuit boards, X-Rays, and more. Light to moderate lifting is required with weights up to 30lbs.
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Job Type
Full-time
Career Level
Mid Level
Education Level
Associate degree