Plating - Weekend Shift - 90 Day Increase Eligible

TTM•Denver, CO

1d•Onsite

About The Position

The Inner Layer Wet Process Operator uses wet chemistry to etch circuit images and apply oxide to panels. Operators develop resist from layers, etch to remove copper that is not protected by resist, and strip off resist that was left from develop and etch cycles to expose circuit. Process panels through developer to remove excess resist on all unexposed areas of panel.

Requirements

Functional English skills (reading, writing, speaking)
Attention to detail
Adherence to all safety requirements of the position
As required to run process according to Unicircuit Training guidelines
The employee is responsible to follow all RCRA standards as outlined by the certification that he or she has been trained to at all times.
The health and safety regulations encompass the cleanliness of the area that he or she will be working as a result.
May handle hazardous waste as outlined in departmental work instructions.
The following RCRA training is required on initial hire and on an annual basis thereafter Introduction to RCRA, Properties of Facility Waste, Waste Minimization Accumulation, Container Management, and Emergency Response Plan.
Ability to lift 50 lbs.
Ability to work with chemicals.
Ability to work on feet for entire shift.
Must comply with TTM Export Control Policies and Procedures and all applicable laws including ITAR, EAR and OFAC including but not limited to: a) being able to identify ITAR product on the manufacturing floor and understand that access to these products and related technical data is restricted to only US Citizens and US Permanent Residents; b) recognition of Foreign Person visitors by badge differentiation; c) understand and follow authorization procedures for bringing foreign visitors into facilities (VAL); d) understand the Export and ITAR requirements for shipments leaving the US; e) manage vendor approvals for ITAR manufacturing and services.

Responsibilities

Check ph to ensure it remains within established limits.
Run break test to determine conveyor speed for developing.
Check developing solution for proper concentration as specified by MPP.
The resist strip process is the removal of photo resist exposing the copper circuits.
Monitor and maintain proper solution levels on all rinse sumps.
Change solutions per tank maintenance.
Verify solution temperatures.
Ability to process first article panel.
Monitor to insure uniform and constant flow of work through appropriate resist stripper.
Follow all preventive maintenance schedules.
Follow all requirements for waste treatment.
Inspect panels for defects.
Cupric etching is a process whereby exposed copper is dissolved into a cupric based etchant.
Process panels per inner layer MPP:
Maintain automatic chemical feed and bleed systems.
Monitor and maintain proper solution levels on all rinse sumps.
Change solutions per tank maintenance or preventive maintenance.
Verify etchant temperatures.
Monitor etchant specific gravity.
Run spray nozzle test and etch break test daily.
Process first article panels.
Measure spacing and line width with microscope.
Set and monitor conveyor speed depending on copper thickness.
Monitor process to insure uniform and constant flow of work through etcher.
Follow all preventive maintenance schedules.
Follow all requirements for waste treatment.
Inspect panels for defects.
Perform other duties as assigned.