IC Packaging Integration Engineer
About The Position
Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for versatile and passionate IC Packaging Engineer to join our team!• You will be responsible for IC packaging development Work with cross-functional teams and lead SoC Package integration and architecture efforts Drive the industry with advanced package solutions, new material developments, and specsMS/PhD and 6+ years of experience in relevant industry. We are looking for someone experienced in the semiconductor packaging and/or system integration. Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component u0026 system level reliability, testing, FA and package-system integration. Specialist in advanced packaging technologies (FOWLP/2.5D/3D): Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints. Excellent problem solving with strong physics and fundamentals. Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers. Basic knowledge of signal integrity/power integrity. Ability to review schematics, package/PCB layout and designs in Allegro.
Requirements
- MS/PhD and 6+ years of experience in relevant industry.
- Experienced in the semiconductor packaging and/or system integration.
- Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component u0026 system level reliability, testing, FA and package-system integration.
- Specialist in advanced packaging technologies (FOWLP/2.5D/3D): Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints.
- Excellent problem solving with strong physics and fundamentals.
- Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers.
- Basic knowledge of signal integrity/power integrity.
- Ability to review schematics, package/PCB layout and designs in Allegro.
Responsibilities
- IC packaging development
- Work with cross-functional teams and lead SoC Package integration and architecture efforts
- Drive the industry with advanced package solutions, new material developments, and specs
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
Industry
Computer and Electronic Product Manufacturing
Number of Employees
5,001-10,000 employees
