IC Packaging Engineer

Apple•Cupertino, CA

8d•$150,400 - $225,300•Onsite

About The Position

Imagine what you can do here. Apple is a place where extraordinary people gather to do their lives best work. Together we create products and experiences people once couldn't have imagined, and now, can't imagine living without. It's the diversity of those people and their ideas that inspires the innovation that runs through everything we do. Architect thermal solutions to address chip energy efficiency and performance scaling. Run Computational Fluid Dynamics (CFD) and heat transfer analysis. Work with cross functional teams on silicon design, system thermal design, and debug issues. Provide thermal modeling solutions to mobile devices at silicon die and semiconductor package levels. Optimize advanced Integrated Circuit (IC) design scheme/floor-planning to ensure good thermal performance. Develop detailed and reduced-order thermal models. Analyze simulation and measurement results to enhance product thermal management.

Requirements

Master's Degree or foreign equivalent in Mechanical Engineering or related field and 4 years of experience in the job offered or related occupation.
Utilizing fundamental heat transfer principles and analytical equations to evaluate and optimize packaging thermal design across silicon and system levels
Utilizing C++ or Python to implement conductive heat transfer models and automate thermal simulation workflows
Utilizing CFD tools to analyze flow field and heat transfer in air cooled or liquid cooled systems
Designing and implementing advanced cooling solution design to maximize thermal performance across product platforms
Designing and improving packaging architecture to improve maximum sustaining power and thermal efficiency.
Utilizing CAD tools to design, prototype, and manufacture advanced cooling components and thermal management hardware
Utilizing two phase heat transfer theory to design and optimize cold plate solutions for high power applications
Designing and running thermal characteristic tests to measure and validate the thermal response of products under realistic operating conditions.
Utilizing fluid dynamics principles to optimize pressure drop, flow distribution and coolant flow rate in thermal systems

Responsibilities

Architect thermal solutions to address chip energy efficiency and performance scaling.
Run Computational Fluid Dynamics (CFD) and heat transfer analysis.
Work with cross functional teams on silicon design, system thermal design, and debug issues.
Provide thermal modeling solutions to mobile devices at silicon die and semiconductor package levels.
Optimize advanced Integrated Circuit (IC) design scheme/floor-planning to ensure good thermal performance.
Develop detailed and reduced-order thermal models.
Analyze simulation and measurement results to enhance product thermal management.