New College Grad - IC Package Layout Engineer

Micron TechnologyBoise, ID

About The Position

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Become a member of our distinguished team at Micron Technology, where we are redefining the use of information to enrich lives everywhere. As an early-career IC Package Layout Engineer, you will grow your technical skills while contributing to the invention and implementation of advanced semiconductor packages. These packages are used in Micron's industry-leading memory and storage products. You will work alongside experienced engineers in a collaborative environment, gaining hands-on experience with package layout design, design verification, and manufacturing processes.

Requirements

  • Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or a related engineering field.
  • Graduation within the last 12 months or expected graduation prior to start date.
  • Strong analytical and problem-solving skills.
  • Strong verbal and written communication skills.
  • Ability to work effectively in a collaborative, cross-functional environment.

Nice To Haves

  • Coursework, internship, co-op, or project experience related to PCB design, IC package design, electronics, or semiconductor technologies.
  • Exposure to CAD or EDA design tools.
  • Basic understanding of signal integrity (SI) and power integrity (PI) concepts.
  • Experience with scripting or automation tools such as Python or similar languages.
  • Demonstrated leadership through student organizations, projects, research, or internships.

Responsibilities

  • Develop IC package layouts for products including DDR, LPDDR, GDDR, NAND, and ASIC.
  • Support feasibility studies, mechanical substrate layouts, and package design activities.
  • Create and maintain PCB and IC Package Libraries (footprint creation) and execute package layout processes following established methodologies.
  • Participate in layout reviews with cross-functional engineering teams and generate layout documentation and drawings.
  • Perform Build Rules Checks (DRC) and utilize validation tools to ensure design quality and manufacturability.
  • Collaborate with Package Design, Signal Integrity, Product Engineering, Assembly, and CAD teams to deliver quality product solutions.
  • Support continuous improvement and design automation initiatives.
  • Utilize AI-enabled tools and data-driven workflows to improve engineering productivity, design quality, and decision making.

Benefits

  • Choice of medical, dental and vision plans
  • Benefit programs that help protect your income if you are unable to work due to illness or injury
  • Paid family leave
  • Robust paid time-off program
  • Paid holidays
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