IC Designer

CienaNew Providence, NJ
7d

About The Position

As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity—driving our business priorities alongside meaningful social, community, and societal impact. You’ll join a team advancing the optoelectronic interface that powers high‑speed optical communications. This role shapes the performance, power efficiency, and signal integrity of next‑generation systems by designing industry‑leading analog and mixed-signal integrated circuits. Your work sits at the intersection of IC technology, communications systems, packaging, and optics—driving innovation that directly impacts Ciena’s adaptive network solutions. How you will make an impact:

Requirements

  • Ph.D. in wireline IC design, or M.S. with 2+ years of relevant industry experience (+).
  • Demonstrated experience designing high‑speed circuits with bandwidths ≥10 GHz.
  • Proficiency in low‑speed analog and mixed‑signal circuit fundamentals.
  • Hands‑on experience with high‑speed analog/RF layout techniques.
  • Expertise in electromagnetic modeling for inductors, T‑coils, and transmission lines.
  • Experience working in SiGe BiCMOS, FD‑SOI CMOS, and/or FinFET CMOS technologies.
  • Background in laboratory testing and debugging of analog and mixed-signal integrated circuits.

Nice To Haves

  • Familiarity with optical communications systems and optoelectronic device interactions.
  • Understanding of signal‑integrity considerations in advanced packaging environments.
  • Experience streamlining design workflows through scripting or automation.
  • Exposure to mixed‑signal system‑level modeling methodologies.
  • Participation in silicon bring‑up, validation, and characterization phases.
  • Knowledge of multidisciplinary hardware development practices.
  • Awareness of advanced photonic‑electronic integration trends.

Responsibilities

  • Design and lay out high‑performance analog and mixed‑signal circuits, including TIAs, modulator drivers, laser drivers, CTLEs, VGAs, operational amplifiers (op‑amps), bandgaps, DACs, and ADCs.
  • Model electromagnetic structures such as inductors, T‑coils, and transmission lines to optimize high‑speed performance.
  • Execute laboratory testing and debug activities for analog and mixed‑signal integrated circuits.
  • Apply programming skills in Python, Verilog‑A, and Cadence SKILL to support design automation and verification.
  • Collaborate across IC technology, communications systems, signal integrity, packaging, and optical engineering disciplines.
  • Integrate advanced silicon IC technologies into leading‑edge optoelectronic interfaces.
  • Contribute to continuous improvement of circuit efficiency, bandwidth, noise performance, and overall signal integrity.

Benefits

  • medical, dental, and vision plans
  • participation in 401(K) (USA) & DCPP (Canada) with company matching
  • Employee Stock Purchase Program (ESPP)
  • Employee Assistance Program (EAP)
  • company-paid holidays
  • paid sick leave
  • vacation time
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