High Speed PCB Senior Staff Layout Designer (RF / Optics)

Marvell TechnologyOttawa, ON
CA$115,700 - CA$154,300

About The Position

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. This is an existing vacancy. Your Team, Your Impact The Cloud Platform Optics team builds highly integrated component platforms with high-speed Silicon photonics, transmit and receive amplifiers, controller ASIC’s with Marvell DSP’s. These components are made operational with a highly functional embedded firmware. The team is responsible for design, verification, and validation of these integrated high speed optical components. The team performs system level testing under various operating conditions, and validates the performance of the hardware, firmware and control loops. An engineer in this team will be involved in a full product lifecycle and will carry new products from inception all the way to NPI. What You Can Expect

Requirements

  • Bachelor’s degree in electrical engineering or related field
  • 10+ years of PCB layout experience, preferably in RF PCB layout (GHz frequencies)
  • Deep understanding of: Controlled impedance routing, Differential pair routing and length matching, Crosstalk mitigation, Return paths and grounding strategies, Shielding and sensitive signal routing
  • Experience with multilayer stack-up design (10+ layers typical)
  • Proficiency in industry-standard CAD tools: Cadence Allegro / OrCAD PCB Designer (preferred) or Altium Designer (acceptable)

Nice To Haves

  • Familiarity with SI/PI fundamentals
  • Knowledge of PCB materials for high-frequency design
  • Thermal considerations in compact modules
  • High-density interconnect (HDI) designs (microvias, blind/buried vias)
  • Familiarity with co-design environments (electrical + mechanical integration)
  • Proficiency in scripting and automation tools to streamline PCB layout design workflows

Responsibilities

  • Design complex multilayer PCB layouts for: RF front-end circuits (GHz range), High-speed SERDES interfaces, Differential pairs with tight impedance control, RF transmission lines and matching networks
  • Collaborate with cross-functional teams: Hardware design engineers, Signal Integrity (SI) and Power Integrity (PI) engineers, Mechanical and packaging teams
  • Perform constraint-driven PCB layout using CAD tools
  • Ensure compliance with: Signal integrity and EMI/EMC requirements, Thermal and mechanical constraints for dense modules
  • Support stack-up definition and material selection for high-frequency performance
  • Perform layout reviews and incorporate feedback into layout improvements
  • Work with manufacturers and vendors on: DFM (Design for Manufacturability), DFA (Design for Assembly)
  • Generate and release fabrication deliverables: Gerbers, ODB++ Fab drawing, Assembly documentation

Benefits

  • competitive compensation
  • great benefits
  • workstyle within an environment of shared collaboration, transparency, and inclusivity
  • tools and resources they need to succeed in doing work that matters, and to grow and develop with us
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