Head of Platform Mechanical & Thermal Engineering
About The Position
Our Platform Team designs the servers and systems that deliver our chips’ full potential. We are seeking a Head of Platform Mechanical & Thermal Engineering to lead all aspects of mechanical architecture, advanced cooling, and CAD infrastructure for next-generation high-power density ASIC systems. This leader will build and scale the mechanical and thermal engineering organization, with a strong focus on liquid cooling technologies and rack-level thermal management. Siemens NX is our standard 3D CAD platform, and you will also drive the deployment of industry-leading CFD and rack simulation tools to ensure performance, manufacturability, and reliability at datacenter scale.
Requirements
- 10+ years of experience in mechanical and thermal engineering for high-performance computing systems, with at least 5+ years in leadership roles.
- Proven expertise in liquid cooling architectures for high-power density ASICs or GPUs.
- Proficiency with Siemens NX for 3D CAD; experience scaling CAD/PLM environments across teams.
- Hands-on experience with Flowtherm, Ansys Icepak, and MacroFlow for CFD and rack-level thermal modeling.
- Strong record of bringing complex server or datacenter platforms from concept through production.
- Deep understanding of thermal validation, fluid integrity testing, and mechanical reliability for liquid-cooled systems.
- Bachelor’s or Master’s in Mechanical Engineering, Thermal Engineering, or related field.
Responsibilities
- Build, mentor, and scale a team of mechanical and thermal engineers.
- Define hiring plans and technical standards for advanced cooling and mechanical design.
- Foster a culture of engineering rigor and cross-disciplinary collaboration.
- Own the design of server enclosures, modules, and racks optimized for high-power ASICs.
- Drive liquid cooling solutions (cold plates, manifolds, quick-disconnects, CDU integration) as well as air-assisted hybrid cooling where applicable.
- Ensure mechanical designs meet standards for manufacturability, serviceability, and reliability under extreme thermal loads.
- Deploy and optimize Siemens NX for CAD/PLM workflows, with integrated libraries and release processes.
- Establish and scale simulation infrastructure, including: Flowtherm and Ansys Icepak for detailed CFD of component and system thermal behavior. MacroFlow for rack-level and datacenter fluid dynamics modeling.
- Standardize validation workflows linking simulation to hardware measurements.
- Define test plans for thermal performance, fluid integrity, and long-term reliability of liquid cooling systems.
- Oversee lab infrastructure for thermal and mechanical validation at both module and rack scale.
- Partner with electrical and system validation teams to ensure holistic system readiness.
- Collaborate closely with silicon, electrical, and system engineers to co-optimize cooling with chip and board power delivery.
- Engage with suppliers, ODMs, and datacenter partners to align design with deployment environments.
- Represent mechanical and thermal engineering in executive reviews, providing visibility into risks, milestones, and resources.
Benefits
- Medical, dental, and vision packages with generous premium coverage
- $500 per month credit for waiving medical benefits
- Housing subsidy of $2k per month for those living within walking distance of the office
- Relocation support for those moving to San Jose (Santana Row)
- Various wellness benefits covering fitness, mental health, and more
- Daily lunch and dinner in our office
- Unlimited compute budget subject to ROI justification
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What This Job Offers
Job Type
Full-time
Career Level
Manager
