HBM Product Engineer

Micron • Richardson, TX

4d

About The Position

Design, analyze, and validate test structures and layout for advanced HBM (High Bandwidth Memory) products. Collaborate with cross-functional teams including design, process, and package engineering to optimize thermal, electrical, and mechanical reliability. Perform failure analysis, resistance extraction, and design rule verification using tools such as Cadence Virtuoso, Calibre, and scripting languages. Lead efforts in layout optimization and co-design with package and die teams for product qualification and yield improvement. Create test structures, test chip development, design rule development and product layout feature analysis for chip package interactions.

Requirements

• Data Analysis
• Layout and Design Rule check
• 3D integration
• Semiconductor process
• Thermal simulation

Nice To Haves

• Cadence Virtuoso
• Calibre
• scripting languages

Responsibilities

• Design, analyze, and validate test structures and layout for advanced HBM (High Bandwidth Memory) products.
• Collaborate with cross-functional teams including design, process, and package engineering to optimize thermal, electrical, and mechanical reliability.
• Perform failure analysis, resistance extraction, and design rule verification using tools such as Cadence Virtuoso, Calibre, and scripting languages.
• Lead efforts in layout optimization and co-design with package and die teams for product qualification and yield improvement.
• Create test structures, test chip development, design rule development and product layout feature analysis for chip package interactions.

Benefits

• choice of medical, dental and vision plans
• benefit programs that help protect your income if you are unable to work due to illness or injury
• paid family leave
• robust paid time-off program
• paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: Ph.D. or professional degree