New College Grad - HBM Product Development Failure Analysis Engineer

Micron Technology • Boise, ID

5d

About The Position

The Product Development Failure Analysis (PDFA) team plays a critical role in bringing next-generation High Bandwidth Memory (HBM) products from initial design through high-volume manufacturing. The team partners closely with Product, Process, Quality, and Test Engineering organizations to identify, analyze, and resolve product and process-related issues that impact yield, reliability, and overall product performance. As an HBM Product Yield Enhancement PDFA Engineer, you will focus on product reliability and component-level failure analysis during new HBM product introductions. You will use electrical characterization, physical analysis techniques, statistical methodologies, and AI-enabled data analysis tools to identify failure mechanisms and drive rapid production ramp. This role requires strong analytical skills, multi-functional collaboration, and the ability to translate complex data into actionable engineering solutions.

Requirements

• Bachelor's degree in Electrical Engineering, Computer Science, Physics, Materials Science, or a related technical field, or equivalent experience.
• Experience or coursework in semiconductor device physics, semiconductor manufacturing processes, or VLSI design.
• Demonstrated knowledge of statistical analysis techniques and data-driven problem solving.
• Experience using Python or similar programming languages for data analysis and engineering applications.
• Ability to analyze complex technical data and communicate findings effectively in a collaborative engineering environment.

Nice To Haves

• Master's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related field.
• Academic or industry experience in semiconductor failure analysis, yield enhancement, reliability engineering, or product characterization.
• Experience applying AI, Generative AI, or AI-assisted analytical tools to support engineering investigations and data analysis.
• Knowledge of test methodologies, process integration, and advanced memory technologies, including HBM products.
• Experience working with large datasets and applying statistical software or machine learning techniques to identify failure trends and process improvements.

Responsibilities

• Perform electrical, physical, and statistical failure analysis to identify and understand component failure mechanisms.
• Analyze characterization and manufacturing data to determine root causes of fabrication, assembly, and test-related failures.
• Collaborate with Product, Process, Quality, and Test Engineering teams to resolve yield, reliability, and process defect issues.
• Leverage AI-enabled tools and statistical methods to evaluate large datasets, identify trends, and improve component performance.
• Communicate findings, corrective actions, and risk assessments to multi-functional partners to support successful product qualification and production ramp.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level