HBM Design Engineering Lead - MTS/SMTS/DMTS

Micron Technology • Richardson, TX

9d

About The Position

Micron Technology is a world leader in innovating memory and storage solutions. This role will focus on shaping next-generation High Bandwidth Memory (HBM) solutions for artificial intelligence and accelerated computing. The individual will serve as a senior technical contributor and technical project leader, guiding work from architecture definition through silicon bring-up and post-silicon support. Collaboration across design, process, packaging, and product teams is essential to deliver reliable silicon with broad business impact. The role involves influencing future memory architectures while mentoring engineers and improving design execution.

Requirements

• 15+ years of experience in DRAM, HBM, advanced memory, system-on-chip, or application-specific integrated circuit design roles.
• Proven experience delivering complex designs from architecture through silicon bring-up and post-silicon debug.
• Strong expertise in DRAM operation and JEDEC standards, preferably including HBM product families.
• Extensive experience with complementary metal-oxide-semiconductor circuit design, transistor-level design, and semiconductor device physics.
• Demonstrated technical project leadership across multidisciplinary engineering teams.

Nice To Haves

• Experience with digital design using Register Transfer Level methodologies such as Verilog, or similar.
• Experience with analog modeling and simulation tools such as FastSpice, HSPICE, or similar.
• Deep technical expertise in one or more areas such as DRAM memory array design, high-speed clocking and interface design, logic and custom circuit design, or power delivery optimization.
• Exposure to 2.5D or 3D packaging technologies, including through-silicon vias, hybrid bonding, or interposers.
• Strong communication skills, with the ability to explain complex technical concepts to engineers, leaders, and customers.

Responsibilities

• Own and deliver critical High Bandwidth Memory (HBM) design blocks and subsystems from architectural definition through schematic, implementation, verification, tape-out, and post-silicon debug.
• Drive robust, high-performance designs by balancing performance, power, reliability, yield, and manufacturability trade-offs.
• Lead root-cause analysis and resolution of complex pre-silicon and post-silicon issues across circuit design, architecture, process integration, and packaging interactions.
• Serve as technical project lead for one or more HBM programs, coordinating execution across architecture, layout, verification, validation, process integration, packaging, test, and product engineering teams.
• Define and communicate technical strategy, priorities, and execution plans while proactively identifying risks, dependencies, and schedule impacts.
• Research, develop, and influence next-generation HBM architectures aligned with artificial intelligence, machine learning, and high-performance computing workloads.
• Apply deep knowledge of Dynamic Random-Access Memory (DRAM) operation, Joint Electron Device Engineering Council (JEDEC) specifications, memory subsystems, and high-speed interfaces to architect scalable, future-ready solutions.
• Mentor engineers through design reviews, architectural guidance, and hands-on problem-solving while driving improved design methods, best practices, and execution discipline across HBM programs.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: No Education Listed