About The Position

This internship offers hands-on experience in hardware innovation, focusing on micro-soldering and device diagnostics. The role is based on-site in West Lafayette, IN. Ixana, a Purdue University spinoff, is pioneering brain-inspired wearable computing with its patented Wi-R communication technology, which is significantly more energy-efficient than Bluetooth or Wi-Fi. The company is building the next era of real-time, AI-powered human-computer interaction with a team of 60 people. Wi-R technology enables secure, wire-like wireless experiences with unprecedented energy efficiency, making long-term wearable and implantable devices practical. Demos of high-speed data streaming through skin contact are available on ixana.ai.

Requirements

  • Interest in micro-soldering, SMT rework, and hardware troubleshooting
  • Comfortable using oscilloscopes, logic analyzers, reflow ovens, and microscopes
  • Precision-focused and detail-oriented approach to problem-solving
  • Enthusiasm for learning hardware repair techniques in a fast-paced environment

Nice To Haves

  • Background in Electrical Engineering or a portfolio demonstrating lab experience
  • Technician certifications like IPC/WHMA, J-STD-001, or similar
  • Exposure to low-power IoT, wearable devices, or prototype hardware
  • Familiarity with AOI or X-ray inspection for fine-pitch PCBs

Responsibilities

  • Perform high-precision micro-soldering, re-balling, and SMT-level rework on prototype PCBs
  • Assist in diagnosing board-level faults using oscilloscopes, logic analyzers, and test benches
  • Help execute hardware ECOs, manage lab tools, and maintain reflow ovens
  • Document issues with failure photos, trace captures, and test logs
  • Work closely with design engineers to debug and enhance prototype performance

Benefits

  • Competitive hourly pay with performance-based bonuses
  • Relocation support and visa sponsorship (if applicable)
  • Possibility of equity grants based on role and status
  • Hands-on experience designing hardware for wearable and biomedical applications
  • Exposure to deep tech and end-to-end product development in a fast-paced environment
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