2027 Hardware Mechanical Engineer Intern - Rolling Meadows IL

Northrop Grumman•Rolling Meadows, IL
•$21 - $46•Onsite

About The Position

An internship at Northrop Grumman is unique. Sure, you’ll learn new skills, explore our enterprise, network with experts, connect with thought leaders, and finish with a resume that opens doors. But you’ll gain something even more valuable: pride in what you’ve done. Join us and launch your career. We’ll support you with training, professional development and networking opportunities, and our shared vision of global security. Northrop Grumman is seeking Hardware Mechanical Engineers for an internship opportunity. This position will be located at our Mission Systems sector in Rolling Meadows, IL. The qualified candidate will become part of Northrop Grumman’s Multidomain Sensing, Targeting and Survivability (MSTS) Division. Rolling Meadows, IL employees are all about redefining what’s possible in the realms of navigation, targeting, and state-of-the-art self-protection. The systems that they design, build, integrate and test are created with the dynamics of present and future operational stakes in mind.

Requirements

  • Be a student who is enrolled full-time and pursuing an undergraduate or graduate degree from an accredited college/university and will be enrolled full time in Fall 2027
  • Be majoring in Mechanical Engineering, Aerospace Engineering, or a closely related STEM (Science, Technology, Engineering or Math) degree
  • Be available to work full-time (40 hours per week) for at least 10 weeks during summer 2027.
  • Be able to obtain and maintain a U.S. Government security clearance (U.S. citizenship is a pre-requisite) as well as Program Special access within a reasonable period of time, as determined by the company to meet its business needs (U.S. citizenship is a pre-requisite)

Nice To Haves

  • Have an overall cumulative GPA of 3.0/4.0 or higher
  • A current/active U.S. Government Secret clearance
  • Siemens NX, SolidWorks, Creo, 3D CAD Modeling, Additive Manufacturing, thermal analysis, structural analysis, microelectronics design, opto-mechanical design, environmental testing, ANSYS, ZEMAX, Zuken, Cadence, Hardware IPT Lead, PLM, PDM, Lead, electronics packaging, optics packaging, circuit card, circuit card assembly, FRACAS, DVT, program capture
  • Demonstrated capability or experience in leading small to moderately sized teams during the product development process
  • Demonstrated application of innovative solutions to complex problems that arise within the design, development, and production phases
  • Strong written, verbal and interpersonal communication skills including experience presenting at design reviews

Responsibilities

  • Research, design, develop, and test a variety of electronic equipment, systems, and products such as but not limited to circuitry components, sensors/antennas, transmitters/receivers, analog and digital computers.

Benefits

  • health insurance coverage
  • life and disability insurance
  • savings plan
  • Company paid holidays
  • paid time off (PTO) for vacation and/or personal business
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