Hardware Engineering Manager

Lam Research•Tualatin, OR

1d•Hybrid

About The Position

You will be part of Lam Research’s Equipment Intelligence and Sensor Engineering organization within the Deposition Product Group (DPG). This team is responsible for developing next‑generation sensing, imaging, and data‑driven capabilities that enable differentiated performance across Lam’s product portfolio. The organization focuses on integrating advanced sensor systems—including optical, thermal, acoustic, chemical, and multi‑modal sensing—into semiconductor capital equipment to enable real‑time visibility, control, and optimization. This includes development of modular sensor platforms, edge compute architectures, and scalable system integrations that support both new product introduction (NPI) and installed base enhancement. Our teams operate at the intersection of mechanical systems, optics, electronics, controls, software, and data science—partnering globally to deliver robust, high‑performance solutions that accelerate innovation, improve tool intelligence, and enable next‑generation capabilities across all Lam product lines. The organization operates in a matrix structure, where mechanical, electrical, optical, and software engineers collaborate closely across shared programs and platforms, requiring strong cross-functional alignment and shared ownership of outcomes. As a Hardware/Mechanical Engineering Manager within the Equipment Intelligence and Sensor Engineering team, you will play a critical leadership role in enabling the mechanical architecture, integration, and deployment of advanced sensor systems across Lam platforms. Your work will directly impact the scalability, reliability, and performance of sensing solutions that drive equipment intelligence—enabling improved process control, fault detection, and system optimization. You will lead a team responsible for designing and integrating complex opto‑mechanical and electro‑mechanical assemblies, working in close partnership with Electrical Engineering, Firmware Engineering, and other functional teams to ensure cohesive system architectures to build sensor sub-systems that are robust, manufacturable, and seamlessly integrated at the system level. Success in this role requires effective leadership within a matrix organization, influencing functional boundaries while maintaining accountability for mechanical deliverables. This role requires balancing deep technical engagement with strong execution discipline across fast‑paced NPI and innovation programs. This is a high‑visibility position where your leadership will influence platform strategy, cross‑product standardization, and the evolution of modular sensing architectures across Lam. This role sits at the forefront of transforming traditional semiconductor equipment into intelligent, sensor‑rich systems. You will have the opportunity to shape platform‑level architectures that combine hardware, sensing, and data—impacting not just a single product, but the evolution of equipment intelligence across an entire portfolio.

Requirements

Bachelor's degree in mechanical engineering (BSME) with 10+ years of experience, OR Master’s degree (MSME) with 7+ years of experience, OR PhD with 5+ years of experience.
A portion of experience in engineering management or technical leadership roles.
Demonstrated ability to lead and develop teams aligned with Lam core values and a high‑performance culture.
Strong background in design of complex electro‑mechanical or opto‑mechanical systems.
Experience leading engineering efforts through product development or NPI lifecycles.
Experience working in matrix organizations with cross‑functional ownership across multiple disciplines.
Experience collaborating with Electrical and Firmware teams on integrated hardware systems.

Nice To Haves

Experience with semiconductor capital equipment or similar high‑complexity systems.
Background in optical systems, imaging, or sensor integration.
Strong understanding of: DFMEA and reliability engineering, Tolerance analysis and precision design, Thermal and structural analysis
Experience with modular platform development and cross‑product standardization.
Exposure to sensor systems, edge compute platforms, or data‑driven system architectures.
Experience supporting production ramp and field issue resolution.
Demonstrated success in mentoring senior engineers and building high‑impact technical teams.
Experience collaborating closely with Electrical Engineering teams on integrated hardware/system design.
Demonstrated success influencing across organizational boundaries and aligning multiple stakeholders in complex development environments.
Experience working with embedded systems and firmware‑driven hardware platforms.
Familiarity with hardware‑firmware co‑design, including sensor control, data acquisition, and real‑time system behavior.

Responsibilities

Define and drive mechanical architectures for advanced sensor platforms, including imaging systems, optical assemblies, and integrated sensing modules.
Enable modular, scalable designs that can be deployed across multiple product lines and applications.
Guide design tradeoffs across performance, integration constraints, reliability, and cost.
Ensure designs meet functional, environmental, reliability, and safety requirements.
Drive strong integration with Systems Engineering to ensure robust subsystem interfaces and system‑level performance.
Review mechanical designs, CAD layouts, tolerance analyses, and BOM structures.
Ensure designs meet manufacturability, serviceability, reliability, and cost targets.
Partner closely with Manufacturing Engineering, Supply Chain, and Operations to enable smooth transition to production and scale.
Promote platform reuse, component standardization, and cost optimization.
Work closely with Electrical Engineering leadership to define integrated hardware architectures for sensor and equipment intelligence systems.
Ensure mechanical designs support electrical requirements including EMI/EMC, thermal performance, routing constraints, and maintainability.
Enable tight integration between mechanical packaging, electronics, and sensing elements to achieve performance and reliability targets.
Work closely with Firmware Engineering to define hardware‑firmware interfaces, including sensor control, data pipelines, and real‑time system interactions.
Ensure mechanical designs support firmware and system requirements such as access for debugging, calibration workflows, and updateability in production and field environments