Global Product Support (GPS) Engineer - Advanced Packaging

Applied Materials•Santa Clara, CA

1d•Onsite

About The Position

Applied Materials is seeking a Global Product Support (GPS) Engineer to support installation, startup, qualification, and ongoing operation of the Kinex™ Hybrid Bonding platform being deployed for the CTO advanced packaging development programs. The successful candidate will serve as the primary equipment support engineer responsible for bringing the system from installation through process readiness while coordinating closely with Facilities, BESI, Applied Materials product engineering teams, and CTO process development teams. This role combines hands-on equipment support, system integration, startup execution, facilities coordination, and vendor engagement. The engineer will play a key role in establishing Kinex as a strategic advanced packaging platform supporting die-to-wafer hybrid bonding, optical interconnect, and next-generation heterogeneous integration development.

Requirements

BS in Mechanical Engineering, Electrical Engineering, Mechatronics, Systems Engineering or related engineering discipline
3–7 years of engineering experience in semiconductor equipment – new college graduates applications will NOT be considered
Experience supporting semiconductor manufacturing or development equipment
Strong troubleshooting and root-cause analysis skills
Excellent verbal and written communication skills
Ability to work across facilities, vendors, process engineering, and operations teams

Nice To Haves

Experience with advanced packaging equipment
Experience with hybrid bonding, wafer bonding, die attach, packaging, or assembly systems
Experience with wet clean processes and systems
Equipment installation and startup experience
Facilities hookup and utility integration experience
Vendor management and supplier coordination experience
Hands-on experience troubleshooting complex semiconductor equipment
Knowledge of: Automated material handling systems, Vacuum systems, Plasma processing systems, Wet processing equipment, Metrology systems
Experience generating or reviewing: Site prep / installation documentation, Equipment specifications, Startup plans, Qualification procedures
Prior experience with BESI equipment
Hybrid bonding process knowledge
300 mm equipment experience
Project management experience
Cleanroom construction or tool installation experience

Responsibilities

Kinex installation activities from tool dock through release to engineering users
Coordinate Tier 0, Tier 1 and Tier 2 startup activities
Drive closure of installation punch-list items
Support factory acceptance and site acceptance activities with vendors
Develop recovery plans for installation and startup issues
Facility Data Sheet (FDS) development and updates
Coordinate with Facilities, EHS and infrastructure teams
Define and validate tool utility requirements
Support hookup and qualification activities
Perform troubleshooting of mechanical, electrical, automation, and process-related issues
Develop preventative maintenance procedures
Support uptime improvement efforts
Analyze equipment performance and reliability trends
Drive root cause investigations and corrective actions
Act as primary technical interface with BESI and Kinex product engineering teams
Coordinate technical reviews, service activities, upgrades, and modifications
Manage escalation of hardware and software issues
Support implementation of engineering changes and new capabilities
Support hybrid bonding process development activities
Work closely with CTO process engineers and researchers
Enable wafer-to-wafer and die-to-wafer bonding development
Support new module integration and experimental hardware evaluations

Benefits

Supportive work culture that encourages you to learn, develop, and grow your career
Comprehensive benefits package
Participation in a bonus and a stock award program, as applicable

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