Global Applications Engineer - Thermal Systems

Vertiv•Columbus, OH

4d•$131,914 - $164,824

About The Position

Vertiv is seeking a detail-oriented and technically curious Global Applications Engineer - Thermal Systems to support the Thermal Business Unit (BU), with a primary focus on developing and maintaining reference designs for major server and GPU manufacturers in the AI ecosystem. The role involves translating customer thermal requirements into structured reference architectures, ensuring company thermal solutions are documented, validated, and aligned with the roadmaps of leading AI server and GPU platforms. The successful candidate will collaborate cross-functionally with engineering, advanced development, sales, and strategic customers to support the definition and deployment of scalable thermal solutions for high-density AI data centers. This role is ideal for an individual with a strong technical background, experience in product management or thermal system applications looking to grow within a global and fast-evolving market.

Requirements

Bachelor's degree in Mechanical Engineering, Thermal Engineering, Energy Systems, or a related technical field.
4-7 years of experience in product management, thermal engineering, technical sales support, or application engineering within the data center, server cooling, or semiconductor thermal space.
Basic understanding of thermal management technologies (air cooling, direct-to-chip liquid cooling, immersion cooling) and how they apply to high-power GPUs (500W-1000W+).
Familiarity with Nvidia, AMD, and Intel server platforms and their thermal reference design processes is highly desirable.
Ability to clearly document technical requirements and present them to both engineering and non-technical stakeholders.
Experience with requirements management tools, and basic data analysis.
Highly organized, detail-oriented, and comfortable working in a fast-paced, cross-functional environment.
No prior P&L or strategic ownership required.

Nice To Haves

Master's degree
Prior experience working with Nvidia’s Partner Network (NPN) or AMD’s server ecosystem.
Exposure to liquid cooling solutions (CDUs, cold plates, manifolds) for AI clusters.
Knowledge of industry standards (OCP, ASHRAE, ITE).

Responsibilities

Maintain and update thermal system reference designs for AI server platforms from Nvidia (e.g., HGX, MGX, GB200), AMD (Instinct), Intel (Gaudi), and other emerging GPU/accelerator vendors.
Capture and document thermal specifications (cooling capacity, flow rates, temperature ranges, connector types) from partner technical documentation and communicate them to internal engineering teams.
Liaise with technical account managers and partner engineering contacts at Nvidia, AMD, and similar companies to understand upcoming thermal needs for next-generation GPUs and servers.
Contribute to the definition of thermal system requirements, specifications, and application guidelines for AI infrastructure projects.
Assist in developing and maintaining technical collateral, including thermal design guides, compatibility matrices, and configuration tools for data center reference designs.
Work with engineering, advanced development, and regional sales teams to ensure reference designs are technically accurate and commercially ready.
Track thermal reference design trends from competing cooling solution providers and keep updated benchmarking presentations.
Support new product introduction (NPDI) activities by preparing thermal system data sheets, application notes, and partner-facing presentations, training and sales tools.
Participate in technical meetings with server OEMs and GPU manufacturers (under the guidance of senior PMs) to gather thermal requirements and present reference design options.