Intel Foundry Lithography Module Development Engineer

Intel Corporation•Hillsboro, OR

1d•$133,800 - $188,890•Hybrid

About The Position

Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision. Join us and build on our legacy of innovation and collaboration as we deliver world‑changing technology that improves the life of every person on the planet. Intel Foundry Technology and Development (TD) team is looking for an engineer for the Lithography team. TD Lithography Module Engineers are responsible for the development and execution of current and next generation Lithography manufacturing processes. They enable manufacture of innovative device architectures, demonstrate manufacturing viability of complex novel processes, and execute the high-volume lines that manufacture revenue product.

Requirements

Must possess a PhD degree in Chemistry, Physics, Material Science, Chemical Engineering, Nuclear Engineering, Electrical Engineering, Mechanical Engineering, or other science or engineering fields of study that include relevant experimental work.
Must have the required degree or expect the required degree within one year of application.
2+ years of experimental lab work experience

Nice To Haves

6+ months of academic or other experience in equipment or instrumentation troubleshooting, development and maintenance.
Familiarity with common ML/AI frameworks, model development, training, testing, and deployment workflows to solve technical problems.
Experience in C# or Python

Responsibilities

Design and execute experiments and analyze data necessary to develop processes that meet engineering specifications for manufacturing that include safety protocols, automation, facility and supply chain in addition to device performance and yield.
Participate in development of intellectual property that enables novel transistor and interconnect architecture, working with integrated module partners to create and realize novel process flows.
Lithography engineers work with industry partners and equipment suppliers to develop and implement equipment, identify equipment capability shortcomings, propose and evaluate hardware modification to mitigate issues, and implement preventative maintenance needed for stable process lines.
Install and qualify High Volume Manufacturing (HVM) capacity at the TD site during insitu ramp to HVM volumes and operate the manufacturing line in the manufacturing of revenue product.
Participate in the transfer of technology to other Intel factories via the Copy Exactly methodology through training and audit of installation/qualification to ensure matched processing across sites.