FIB-SEM Engineer

HEADWAY TECHNOLOGIES INC•Milpitas, CA

3d•$120,819 - $177,675•Onsite

About The Position

Under the direction of the Sr. Manager of Wafer Characterization, the FIB/SEM Engineer performs physical characterizations and materials/failure analyses of product devices using state-of-the-art analytical FIB/SEMs, prepares sophisticated TEM lamella samples, analyzes results, summarizes findings, and supports the development of new designs, processes, or materials for magnetic recording heads, MRAM, or other devices. This position is in Milpitas, California.

Requirements

Master’s degree in Materials Science, Chemical Engineering, or Physics and/or equivalent relevant experience; alternate qualifications Bachelor's degree in Materials Science, Chemical Engineering, or Physics with three years of experience
Strong knowledge of TEM lamella sample preparation and in-depth understanding of FIB/SEM instrument fundamentals
Strong interest in metrological, materials and failure analyses for the advancement of magnetic recording technology using knowledge and skills of different materials analysis techniques.
Proficient in the use of Microsoft Office Applications
Proficient in the fundamental understandings of FIB/SEM, EDS, EBSD, and 3D tomography
Knowledge and ability to prepare TEM lamella samples, design and conduct experiments, interpret complex data, and recommend correction action
Knowledge of semiconductor or basic HDD industry principles, practices, and techniques
Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
Able to independently create reports, presentations, and written analysis summaries
Strong ability to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
Demonstrated ability to understand and carryout complex instructions given verbally or in writing
Able to work productively and collaboratively with all levels of employees and management
Able to comply with all safety policies and procedures
Demonstrated organizational and time management skills
Demonstrated problem-solving and trouble shooting skills
Flexible and able to prioritize

Nice To Haves

Fundamental understanding or hands-on experience in TEM, STEM, EDS, and EELS is a plus

Responsibilities

Prepares sophisticated TEM lamella samples using different FIB/SEMs to support TEM analyses
Performs device cross-section imaging and metrology through high-resolution SEM/STEM imaging
Performs device failure analysis using different FIB/SEMs attached with EDS
Performs device structure analysis using FIB/SEM 3D tomography
Actively participate in developing new recipes to improve the consistency and efficiency of sample preparation.
Works with other team members to develop new techniques for sophisticated metrology and device/material failure analysis
Proactively responds to issues related to materials quality or the characterization process and initiates resolution
Reviews and analyzes data, creates reports, and presents findings to panels, groups, teams, or departments as required
Interacts and responds to inquiries from other product groups regarding process-related issues and product or device requirements
Adheres to all safety policies and procedures as required
Performs other duties of a similar nature or level