About The Position

The Failure Analysis Technician performs routine failure analysis and supporting QA/QC evaluations, delivering timely and accurate results to engineering and operations teams. The role collaborates with cross-functional groups to help identify and resolve Fab process and yield issues. The position works a second shift Sunday through Wednesday, 3:00 p.m. to 1:30 a.m., after an initial three-month training period scheduled Monday through Friday, 8:00 a.m. to 5:00 p.m. Applicants must be U.S. Persons as defined by ITAR: U.S. citizens, U.S. permanent residents, political asylees, or refugees.

Requirements

  • Associate degree or at least 5 years of experience in the semiconductor industry.
  • At least 3 years of experience operating SEM/FIB/TEM failure analysis tools.
  • Strong computer skills, including Microsoft Office (Outlook, Word, Excel, and PowerPoint).
  • Good communication and problem-solving skills.
  • Strong organizational and multitasking skills, with attention to accuracy and timely execution.
  • Must be a U.S. Person as defined by ITAR: U.S. citizen, U.S. permanent resident, political asylee, or refugee.

Responsibilities

  • Perform high-volume routine SEM, FIB, TEM, and analytical analysis.
  • Manage assigned samples within the imaging queue and complete high-priority requests within required turnaround times.
  • Create and present reports summarizing results, in person and/or virtually.
  • Participate in training across failure analysis techniques and toolsets to support team flexibility and workload demands.
  • Schedule necessary preventive maintenance on imaging tools to follow audit requirements.
  • Assist with basic troubleshooting of failure analysis tools.
  • Operate within established lab safety, quality, and environmental procedures.
  • Collaborate with cross-functional teams to identify and resolve process issues.
  • Work in a team environment and coordinate tool utilization to maximize tool output.
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