Failure Analysis Technician

TSMC • Phoenix, AZ

1d • Onsite

About The Position

A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate its leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future.

As a Failure Analysis Technician, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation and Customer Trust.

TSMC Arizona’s Quality & Reliability is responsible for incoming materials and final product quality, process and product qualification, and failure analysis.

Failure Analysis Technician
Provide crucial support to our Quality & Reliability team by performing precise failure analysis on leading-edge semiconductor devices. This role involves operating advanced analytical tools, preparing samples, handling chemicals safely, and meticulously documenting findings to ensure product quality and aid in process improvement. The Failure Analysis Technician plays a key role in diagnosing issues and contributing to the continuous advancement of semiconductor technology.

Requirements

• Associate's degree (A.A.S.) from a Science/Engineering/Technology program, or related field.
• Basic PC skills (MS Windows OS and MS Office).
• Ability to work independently and prioritize tasks to meet deadlines.
• Must be a team player with a positive attitude and strong work ethic.
• Ability to handle pressure in a fast-paced working environment.
• May be required to work in a cleanroom environment (Near-line FIB/TEM).

Nice To Haves

• Experience in TEM sample preparation for semiconductor devices in advanced process nodes (<28nm).
• TEM analysis experience/skill in HR-STEM imaging and EDS analysis.

Responsibilities

• Operate Dual-Beam FIB to prepare TEM samples or conduct materials analysis (e.g., SIMS & XPS) and SEM imaging.
• Operate TEM for imaging, analysis, and reporting.
• Perform TEM sample preparation, including site marking, de-layering, applying protective coatings (spin coating and/or CVD tools), and other necessary pre-treatments.
• Handle chemicals safely and in accordance with established PPE protocols.
• Collect, organize, and report data to internal and external customers.
• Assist engineers with the development of analytical methods.
• Maintain laboratory housekeeping (6S) environment and protocols.
• Support Fab manufacturing operations and participate in the team’s on-call schedule.

Benefits

• Medical, Dental, and Vision Plans: Choose the options that best fit your and your family’s needs.
• Income-Protection Programs: Financial assistance during injury or illness.
• 401(k) Retirement Savings Plan: Secure your financial future with competitive employer contributions.
• Paid Time-Off Programs and Holidays: Recharge and spend quality time with loved ones.

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level
• Education Level: Associate degree