Failure Analysis Engineer

Allegro MicroSystems•Manchester, NH

3d•Onsite

About The Position

The Failure Analysis Engineer is responsible for performing in-depth analysis of semiconductor integrated circuits (ICs) and other electronic components that have failed in various stages, including design, manufacturing, qualification, and field operation. This role involves utilizing a wide range of analytical techniques to identify root causes of failures, provide timely feedback to design, process, test, and product engineering teams, and contribute to continuous product and process improvement to enhance reliability and performance.

Requirements

Bachelor's or Master’s degree in Electrical Engineering or Computer Engineering is required.
Understanding of semiconductor device physics, IC fabrication processes, and packaging technologies.
Excellent problem-solving skills and a methodical approach to root cause analysis.
Ability to interpret complex electrical schematics and layouts.
Strong written and verbal communication skills, with the ability to present technical information effectively.
Ability to work independently and as part of a team in a fast-paced environment.
Applicants for this position must be legally authorized to work in the U.S without employer sponsorship, now or in the future.
The company will not sponsor employment visas for this position, including F-1, OPT, CPT or other work authorization requiring future sponsorship.
Eligible applicants must reside in a state where Allegro currently has an office location: This includes New Hampshire, Massachusetts, Texas, and Michigan.

Nice To Haves

Familiarity with statistical analysis tools and methodologies for data interpretation.
Experience with programming or scripting for automation of analysis tasks.
Knowledge of reliability testing standards (e.g., AEC-Q100, JEDEC) and failure analysis techniques and equipment is a plus
Experience with Allegro's specific product lines (e.g., magnetic sensors, power management ICs, motor drivers) is a plus

Responsibilities

Conduct comprehensive electrical, physical, and material analysis on failed semiconductor devices (e.g., magnetic sensors, power ICs, motor drivers).
Utilize advanced failure analysis techniques such as optical microscopy, SEM/EDX, FIB, OBIRCH, IR microscopy, X-ray, acoustic microscopy, and chemical decapsulation.
Perform electrical characterization and fault isolation to pinpoint the exact location and nature of failures.
Collaborate closely with design, process, product, test, and reliability engineering teams to understand failure mechanisms and provide actionable insights.
Document failure analysis procedures, findings, and conclusions clearly and concisely in detailed reports.
Maintain and calibrate failure analysis equipment, ensuring optimal performance and accuracy.
Develop and implement new failure analysis methodologies and tools to improve efficiency and capability.
Participate in cross-functional teams to drive corrective actions and preventive measures based on failure analysis results.
Contribute to the continuous improvement of product quality, reliability, and manufacturing processes.