Failure Analysis Engineer

HyperLight • Cambridge, MA

2d • $90,000 - $180,000 • Onsite

About The Position

HyperLight is a leader in the commercialization of thin-film lithium niobate (TFLN) integrated photonics, a technology enabling high-performance optical components for AI/datacom infrastructure, hyperscale computing, quantum computing, and sensing. Founded in 2018, HyperLight has developed the TFLN Chiplet™ platform, a modular and scalable architecture designed for manufacturability and system integration. The company partners with customers and suppliers from concept to mass production. HyperLight has assembled a world-class team and fosters a culture of integrity, innovation, collaboration, and pragmatic solutions, with a diverse team that thrives on challenges and is united by a commitment to excellence.

The Failure Analysis (FA) team at HyperLight is small and impactful. The Failure Analysis Engineer will be trained by the FA lead and will grow to independently manage cases throughout the entire workflow, including intake, analysis planning, hands-on characterization, root cause determination, and reporting findings to the Test, Platform, and Engineering teams. This role involves investigative work, where each measurement is a piece of evidence to be assembled into a comprehensive understanding of failures, emphasizing rigorous analysis over premature conclusions.

Requirements

• BS in materials science and engineering, chemistry, applied physics, physics, electrical engineering, or chemical engineering, plus 3+ years hands-on cleanroom and/or characterization experience; OR MS in one of the above plus 1–2 years; OR PhD in one of the above (graduate research counts toward experience).
• Independent cleanroom experience, qualified and worked unsupervised with at least three of: photolithography and resist processing, plasma/RIE etch, wet etch, thin-film deposition (PVD/CVD/ALD), e-beam lithography. This includes proficiency in contamination and particle control, strict SOP adherence, and maintaining legible, complete logbooks.
• Independent SEM operation, including imaging of insulating and PIC samples, plus EDS acquisition and interpretation.
• Demonstrated ability in experimental rigor: designing analyses with appropriate controls, identifying confounding variables, and separating observation from inference.
• Technical writing skills to produce reports that non-specialist stakeholders can act upon.
• Comfortable working with acids, bases, and solvents, and willing to complete site-specific safety training, including hydrofluoric acid handling.
• Authorization to work in the US is required.

Nice To Haves

• FIB for cross-sectioning, lift-out, and TEM lamella preparation.
• XPS data analysis – peak fitting, charge referencing/correction, chemical-state assignment.
• TEM, or experience scoping and managing outsourced TEM/analytical work.
• Experience with Raman, FTIR, AFM, ellipsometry, profilometry.
• E-beam lithography experience.
• Working knowledge of semiconductor and photonic failure mechanisms: galvanic corrosion, delamination, cracking, electromigration, ESD.
• Familiarity with JEDEC reliability methods (HAST, damp heat, thermal cycling).
• Lithium niobate, integrated photonics, MEMS, or III-V process experience.
• Statistical and spectral data analysis (JMP, Python).
• Experience presenting technical findings to teams whose processes the findings implicate.

Responsibilities

• Own FA cases end to end: define the question, plan the analysis, execute it, and write it up.
• Sequence analyses correctly on irreplaceable samples; prioritize non-destructive before destructive methods and determine when a cross-section is justified given limited samples.
• Perform daily optical microscopy, SEM, and EDS analysis; conduct FIB cross-sectioning and lift-out; utilize AFM, profilometry, and ellipsometry as needed.
• Conduct surface and chemical characterization using XPS, Raman, and FTIR, and interpret the acquired data.
• Specify and manage outsourced analyses (e.g., TEM) with external laboratories.
• Support post-reliability FA on stressed parts (HAST, damp heat, thermal cycling) and customer returns, collaborating with Test and Reliability engineers.
• Perform FA sample preparation and light fabrication for demo and process-feasibility devices in the cleanroom, including resist processing, photolithography, e-beam lithography, metallization, and etching (wet, dry: ion milling and RIE).
• Write clear, evidence-based reports suitable for cross-functional review and present findings to stakeholders including Platform and Foundry.
• Maintain sample chain of custody, case records, and the FA findings database.

Benefits

• Competitive market-based compensation (Salary range $90,000 - $180,000 per year)
• Comprehensive health coverage, including medical, vision, and dental plans for individuals and families
• 401(k) retirement plans with employee matching
• Paid Parental Leave
• Life and disability insurance
• Commuter benefits and subsidies
• Professional growth and mentorship opportunities

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level