NMSI F11X Thin Films Module Engineer-Technologist

Intel Corporation•Rio Rancho, NM

3d•$164,100 - $231,670•Onsite

About The Position

Intel's Advanced Packaging organization bridges the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), enabling the successful deployment of advanced technology nodes and process capabilities for product qualification and high-yield manufacturing. The team drives continuous technology advancement across multiple products while supporting the evolving needs of Intel Foundry customers. Join Intel's Advanced Packaging team as a Senior Technical Leader responsible for driving process innovation across Intel's most advanced semiconductor packaging technologies in volume manufacturing. In this role, you will lead the development, optimization, and manufacturability of critical thin-film deposition processes, ensuring successful transitions from technology development into high-volume production while meeting customer and business requirements. Operating at the intersection of Technology Development and Manufacturing, you will enable next-generation packaging technologies, including EMIB, Foveros, and Silicon Photonics solutions.

Requirements

Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with 8+ years of semiconductor industry experience, including significant experience in thin-film deposition processes.
OR Bachelor's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with 10+ years of semiconductor industry experience, with the majority of experience focused on thin-film process engineering.
Demonstrated success in process development, manufacturing engineering, and technical leadership roles.
Experience collaborating with leading semiconductor equipment suppliers such as AMAT, Lam Research, ASM, or TEL on process and equipment optimization.
Experience supporting fab start-up activities across manufacturing, research and development, quality, and supply chain functions.
Strong knowledge of Statistical Process Control (SPC), Design of Experiments (DOE), and manufacturing automation systems.
Proven ability to solve complex technical challenges in a high-volume manufacturing environment.

Nice To Haves

Ph.D. in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with research publications, patents, or other demonstrated technical contributions in thin-film technologies, and 5+ years of semiconductor industry experience focused primarily on thin-film processes.
Experience with semiconductor thin film deposition technologies such as CVD, PVD, ALD, PECVD, LPCVD, HDP, or Epitaxy.
5+ years of experience in Through-Silicon Via (TSV) thin-film processing.
Experience delivering process solutions across both Technology Development (TD) and High-Volume Manufacturing (HVM) organizations.
Strong cross-functional leadership experience managing diverse technical and business stakeholders.
Semiconductor foundry experience.
Experience with advanced packaging technologies such as EMIB, Foveros, and Silicon Photonics.
Have a strong knowledge of statistics and experimental design; and the ability to apply that knowledge to tool matching, tool qualification, and process development.
Demonstrate the ability to work across organizational boundaries including process engineering, integration and yield.

Responsibilities

Lead process excellence across thin-film deposition technologies, including Chemical Vapor Deposition (CVD), Atomic Layer Deposition (ALD), and Physical Vapor Deposition (PVD).
Drive breakthrough process solutions that improve manufacturability, yield, quality, and cost while supporting Intel's advanced packaging technology roadmap.
Champion safety, quality, yield, throughput, and cost optimization across thin-film deposition processes.
Drive defect reduction, process capability improvements, and film uniformity enhancements through systematic process optimization.
Lead technical problem-solving efforts and deliver innovative solutions that achieve aggressive technology node targets.
Optimize equipment performance in partnership with internal stakeholders and key equipment suppliers.
Develop and implement robust process controls to ensure manufacturing stability and scalability.
Align technical strategies with customer requirements, product roadmaps, and business objectives.
Analyze complex technical data and translate insights into actionable manufacturing solutions.
Own end-to-end resolution of critical manufacturing challenges across multiple engineering disciplines.
Accelerate technology development and production readiness by executing innovative solutions against demanding schedules.
Influence long-term technology direction through technical expertise and strategic decision-making.
Partner closely with Technology Development, High-Volume Manufacturing, Product Engineering, and Business Groups.
Build strong working relationships with Integration, Device, Yield, Quality, Reliability, and Supply Chain teams, as well as external equipment and material suppliers.
Communicate technical findings and recommendations effectively to audiences ranging from engineering teams to executive leadership.
Foster a collaborative environment that enables rapid decision-making and effective problem resolution.
Stay abreast of semiconductor industry trends, emerging deposition technologies, and competitive manufacturing practices.
Drive strategic initiatives that strengthen Intel's leadership in advanced semiconductor manufacturing.
Contribute to technology roadmaps through a combination of deep technical expertise, innovation, and industry insight.
Mentor and develop technical talent while promoting a culture of continuous improvement.