Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Advanced Technology Engineering team is driving the next era of memory innovation, and we’re growing fast as we expand U.S. manufacturing and R&D. We work at the center of breakthrough technology, solving complex challenges that push the industry forward. Our team thrives on fast learning, collaboration, and owning outcomes! The EUV Process Integration TLP leader is responsible for leading advanced lithography process integration and yield execution for technology nodes in high-volume manufacturing environments. This role drives cross-functional integration between Process Integration, Lithography, Yield Engineering, Device Engineering, Defect Reduction, Metrology, and Manufacturing Operations to enable successful EUV technology development, ramp, qualification, and production scaling. The leader will own critical business outcomes related to yield performance, process window optimization, defectivity reduction, cycle time improvement, and manufacturing readiness for advanced EUV-based technologies.
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Job Type
Full-time
Career Level
Senior
Education Level
No Education Listed