Equipment Engineer, Deposition and Thermal Process Development, Microelectronics Research Center

The University of Texas at Austin•Austin, TX

2d•Onsite

About The Position

The Microelectronics Research Center (MRC) laboratories serve users from both universities and corporations across many different fields: electronics, optics, physics, chemistry and astronomy, as well as chemical, mechanical and petroleum engineering. The MRC is more than a clean room with a comprehensive set of advanced nano-fabrication equipment; it is a community of scientists who work together to build advanced technology products and knowledge.

Requirements

Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or related field.
Minimum 3 years of experience with semiconductor or thin-film deposition equipment.
Strong understanding of vacuum systems, gas delivery systems, thermal processes, physical and plasma-based deposition techniques.
Demonstrated experience with equipment diagnostics, troubleshooting, and component-level repair (electronics and mechanical systems).
Experience with thin-film characterization and metrology techniques (e.g., ellipsometry, SEM, AFM).
Experience with electrical characterization of films and devices. (e.g., 4-point probe, Hall, probe station)
Familiarity with cleanroom operations and microfabrication workflows
Relevant education and experience may be substituted as appropriate.

Nice To Haves

Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or related field.
Experience supporting sputtering, evaporation (thermal/e-beam), ALD, furnaces, Rapid Thermal Process, and CVD systems in a research or pilot-line environment.
Familiarity with lithography processes and pattern-dependent deposition (e.g., lift-off, step coverage challenges).
Experience with scripting or data analysis tools (e.g., Python) for equipment monitoring or process correlation.
Experience in a shared-user academic or national laboratory cleanroom.
Knowledge of film stress engineering, adhesion layers, and interface control.

Responsibilities

Own and maintain deposition toolsets (sputtering, evaporation, ALD, CVD, furnaces) to meet uptime, reliability, and performance targets.
Monitor and optimize key system parameters such as pressure control, gas flow, temperature uniformity, plasma stability (for sputtering), and deposition rate control.
Perform tool qualification, calibration, and matching to ensure repeatable film deposition across systems.
Perform advanced diagnostics and root cause analysis for equipment-related issues affecting film quality and system performance.
Conduct hands-on troubleshooting and repair, including replacement of electronic boards, sensors, power supplies, vacuum components, and mechanical assemblies.
Coordinate with vendors on major repairs, upgrades, and preventative maintenance strategies.
Support development and optimization of thin-film deposition processes in collaboration with engineers and researchers.
Establish baseline recipes and process windows for metals, dielectrics, and functional materials.
Ensure equipment capability aligns with lithography-defined requirements such as feature size, step coverage, and pattern transfer.
Utilize and support metrology tools (e.g., ellipsometry, profilometry, SEM, AFM, XRR) to characterize film thickness, uniformity, stress, adhesion, and morphology.
Correlate metrology data with equipment performance to identify drift, non-uniformity, or failure modes.
Maintain a set of electrical characterization systems to support monitoring of electrical quality of films and contacts.
Support data collection, analysis, and process monitoring using scripting tools where applicable.
Work closely with researchers, engineers and technicians to align tool performance with process requirements.
Support downstream integration by ensuring lithography tools meet performance needs for etching, deposition, and lift‑off processes.
Participate in facility planning related to tool upgrades, replacements, and capability expansion.
Collaborate with other process engineers, technicians, and researchers to support process transfer, yield improvement, and multi-step process integration.
Participate in interdisciplinary projects involving lithography, metrology, etching, and deposition.
Train users on equipment operation, capabilities, limitations, and safety practices.
Develop and maintain standard operating procedures (SOPs), training materials, and maintenance documentation.
Provide technical support to researchers for process planning and tool selection.
Ensure safe operation of deposition systems, including vacuum systems, high-voltage components, and process gases.
Maintain compliance with institutional safety standards and cleanroom protocols.
Participate in safety reviews, hazard assessments, and incident response as required.