About The Position
As an Equipment Development Engineer on Micron’s Wafer Bonding Equipment Development team, you’ll help develop next-generation, first-of-a-kind (FAOK) wafer bonding equipment. We take new ideas from concept to hardware, work directly with equipment suppliers to push system capability, and ultimately put those solutions into technology development and manufacturing. This is a hands-on development role with significant technical ownership. You’ll work on precision alignment, overlay, bonding, controls, mechanical systems, automation, equipment data, and new hardware. When today’s equipment can’t meet tomorrow’s requirements, we figure out why and develop a solution! You’ll work closely with process development, manufacturing, suppliers, and engineering teams across Micron. Together, we’ll solve difficult equipment problems, develop new capabilities, and define the equipment roadmap required for future generations of Micron technology.
Requirements
- Bachelor’s degree in Mechanical Engineering, Robotics, Mechatronics, Controls Engineering, Materials Science, Physics, or a related technical field.
- 4+ years of semiconductor equipment, process, manufacturing, or related engineering experience.
- Comfortable troubleshooting complex equipment.
- Comfortable analyzing data.
- Comfortable working across engineering disciplines.
- Comfortable driving technical projects to completion.
Nice To Haves
- Experience with precision alignment, overlay, modeling, or complex electromechanical systems.
- Experience with wafer-to-wafer fusion or hybrid bonding.
- Experience with precision alignment and overlay.
- Experience with motion control.
- Experience with semiconductor equipment development.
- Experience with Python or MATLAB.
- Experience with equipment data and SECS/GEM.
- Experience with sensors and automation.
- Experience with FEA, DOE, PCA, or other modeling techniques.
- Direct development work with semiconductor equipment suppliers.
- An MS or PhD.
- Experience leading technical programs across multiple organizations, suppliers, or sites.
- Desire to take ownership, challenge existing equipment limitations, and help invent better solutions.
Responsibilities
- Own important equipment-development challenges from initial concept through manufacturing implementation.
- Develop new equipment and subsystems with suppliers.
- Evaluate new technologies.
- Qualify hardware.
- Solve difficult equipment problems.
- Continuously improve tool capability.
- Own wafer bonding equipment performance, capability, reliability, availability, and productivity.
- Lead FAOK equipment, hardware, and subsystem development with our suppliers.
- Drive improvements in overlay, alignment, bond-wave behavior, tool matching, defectivity, contamination control, and equipment stability.
- Develop equipment requirements, performance budgets, experiments, simulations, and data-driven solutions.
- Use modeling, automation, equipment data, and advanced analytics to understand system behavior and find opportunities others may not see.
- Lead equipment evaluations, installations, qualifications, upgrades, and major technical improvements.
- Help define our wafer bonding equipment and technology roadmap.
- Present technical recommendations and development strategies to engineering teams, suppliers, and leadership.
- Share expertise, mentor other engineers, and help build a world-class wafer bonding engineering team.
- Demonstrate AI proficiency and utilize AI-enabled workflows and tools for equipment monitoring, troubleshooting, data analysis, and technical problem solving to improve system performance and engineering productivity.
Benefits
- Choice of medical, dental and vision plans.
- Benefit programs that help protect your income if you are unable to work due to illness or injury.
- Paid family leave.
- Robust paid time-off program.
- Paid holidays.
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
