Engineering Intern

HII's Mission Technologies division•Syracuse, NY

3d•$40,911 - $76,419

About The Position

This opportunity resides with Warfare Systems (WS), a business group within HII’s Mission Technologies division. Warfare Systems comprises cyber and mission IT; electronic warfare; and C5ISR systems. HII works within our nation’s intelligence and cyber operations communities to defend our interests in cyberspace and anticipate emerging threats. Our capabilities in cybersecurity, network architecture, reverse engineering, software and hardware development uniquely enable us to support sensitive missions for the U.S. military and federal agency partners. Our team of more than 7,000 professionals worldwide delivers all-domain expertise and advanced technologies in service of mission partners across the globe. Mission Technologies is leading the next evolution of national defense – the data evolution - by accelerating a breadth of national security solutions for government and commercial customers. Our capabilities range from C5ISR, AI and Big Data, cyber operations and synthetic training environments to fleet sustainment, environmental remediation and the largest family of unmanned underwater vehicles in every class. Find the role that’s right for you. Apply today. We look forward to meeting you. Are you a mission driven individual who is looking for a meaningful career? This isn't your average mission! Join HII – Mission Technologies and make a difference by joining us as an Engineering Interns for 2026. The ideal candidate will have a strong academic background in Electrical, Software, or Mechanical Engineering. In this role you will aid with design and analysis for highly complex embedded systems at the heart of various Intelligence, Surveillance, and Reconnaissance (ISR) systems. Applicants should have a high degree of flexibility and creativity to develop successful design solutions that utilize the latest embedded system techniques including microcontrollers, FPGAs, SoCs, and MPSoCs. Applicants will be involved in all stages of R&D projects as well as product development projects. U.S. citizenship required.

Requirements

Engineering Intern 2 - High School Diploma or equivalent + Must be working towards a Bachelor's degree with between 20% and 40% of the required credits completed.
Engineering Intern 3 - High School Diploma or equivalent + Must be working towards a Bachelor's degree with between 40% and 60% of the required credits completed.
Engineering Intern 4 - High School Diploma or equivalent + Must be working towards a Bachelor's degree with more than 60% of the required credits completed.
U.S. citizenship required.

Nice To Haves

Defining requirements, performing schematic capture, executing or managing PCB layout, and executing design verification testing to ensure designs meet project needs
Multi-Gbps serial communications links, simulation of high-speed serial communications links utilizing IBIS models, S-parameters etc.
Power analysis; DC drop, power plane impedance, decoupling analysis
EMI/EMC testing, debug and interpretation of results from testing and experiments
Radar, EW, software defined radio, and electro-optical system design preferred
Work on multi-disciplinary engineering teams
Work in an environment with rapidly changing priorities

Responsibilities

Research, design, development, and testing of complex electrical (digital, power, RF and analog) products or systems.
Conduct prototype development activities to ensure compliance to specifications and project milestones.
Promote effective design and development processes.
Ensure optimal performance of designs.
Create electrical/electronic schematics.
Design complex PCBAs and/or other integrated electrical systems and components, including cabling and wire harnesses.
Design and development of mixed signal systems with MCUs, MPUs, FPGAs, DSPs, SoCs, sensors, power electronics, analog front-end (ADC, DAC), RF front end, high speed memory.(DDR3/4), high speed serial communication (SGMII, Aurora, PCIe Gen 3, USB 3.1) and low speed serial communication interfaces (UART, I2C, SPI).
Conduct analyses addressing issues such as failure, reliability, capacity or capability.
Documentation of designs for internal use and consumption by other subject matter experts, other engineering disciplines and program management.
Collaboration with other engineering disciplines and subject matter experts on system and board level design details.
Hands on system and board level integration and testing; including the drafting of test plans and procedures, rework instructions and other documentation as needed on a design specific basis.