Engineering Intern 2 - 27275

HII's Mission Technologies division•Syracuse, NY

31d

About The Position

This opportunity is with Warfare Systems (WS), a business group within HII’s Mission Technologies division, focusing on cyber and mission IT, electronic warfare, and C5ISR systems. HII supports national intelligence and cyber operations communities, defending interests in cyberspace and anticipating threats through capabilities in cybersecurity, network architecture, reverse engineering, software, and hardware development for U.S. military and federal agency partners. As an Engineering Intern for 2026, the ideal candidate will have a strong academic background in Electrical, Software, or Mechanical Engineering. This role involves aiding with design and analysis for highly complex embedded systems central to various Intelligence, Surveillance, and Reconnaissance (ISR) systems. Applicants should demonstrate flexibility and creativity to develop design solutions utilizing embedded system techniques including microcontrollers, FPGAs, SoCs, and MPSoCs, and will be involved in all stages of R&D and product development projects.

Requirements

High School Diploma or equivalent + Must be working towards a Bachelor's degree with between 20% and 40% of the required credits completed.

Nice To Haves

Experience with: Defining requirements, performing schematic capture, executing or managing PCB layout, and executing design verification testing to ensure designs meet project needs
Experience with: Multi-Gbps serial communications links, simulation of high-speed serial communications links utilizing IBIS models, S-parameters etc.
Experience with: Power analysis; DC drop, power plane impedance, decoupling analysis
Experience with: EMI/EMC testing, debug and interpretation of results from testing and experiments
Experience with: Radar, EW, software defined radio, and electro-optical system design preferred
Ability to: Work on multi-disciplinary engineering teams
Ability to: Work in an environment with rapidly changing priorities

Responsibilities

Research, design, development, and testing of complex electrical (digital, power, RF and analog) products or systems.
Conduct prototype development activities to ensure compliance to specifications and project milestones.
Promote effective design and development processes.
Ensure optimal performance of designs.
Create electrical/electronic schematics.
Design complex PCBAs and/or other integrated electrical systems and components, including cabling and wire harnesses.
Design and development of mixed signal systems with MCUs, MPUs, FPGAs, DSPs, SoCs, sensors, power electronics, analog front-end (ADC, DAC), RF front end, high speed memory.(DDR3/4), high speed serial communication (SGMII, Aurora, PCIe Gen 3, USB 3.1) and low speed serial communication interfaces (UART, I2C, SPI).
Conduct analyses addressing issues such as failure, reliability, capacity or capability.
Documentation of designs for internal use and consumption by other subject matter experts, other engineering disciplines and program management.
Collaboration with other engineering disciplines and subject matter experts on system and board level design details.
Hands on system and board level integration and testing; including the drafting of test plans and procedures, rework instructions and other documentation as needed on a design specific basis.