Engineering Assembly Technician

Leonardo Electronics US Inc•Tucson, AZ

18d•Onsite

About The Position

Responsible for assembly of high-power laser diode devices. Perform precision manual die attach and mechanical assembly. Responsible for assisting Product and R&D Engineers with new product introduction (NPI) and development prototypes. Responsible for performing hands-on assembly of high-power laser diodes devices and support their release to manufacturing. Provide “second person” assistance on assemblies requiring more skill or precision. Support production processes as needed.

Requirements

Associates degree in Electronics or minimum of 5 years of related experience.
Attention to detail and high level of mechanical dexterity is required.
Detail oriented, mechanical dexterity.
Must have excellent communications skills.
Strong computer skills (MS Excel, MS Access) is required.
Ability to perform electro-mechanical assembly in accordance with workmanship standards.
Stand or sit at workstation for entire production shift.

Nice To Haves

Hands-on experience (2 to 5 years) working with lasers as a laser tech is preferred.
Experience in semiconductor manufacturing environment is highly desired in working in 10,000 class clean room environment.
Must wear bunny suit with face and head mask and gloves for entire production shift.
Safety glasses required for some operations.

Responsibilities

Perform manual die attach and laser diode array (LDA) assembly with precision alignment under 20X to 50X magnification.
Work with Engineering staff on new design assemblies and protocols.
Analyze and report technical data to ensure products meet requirements.
Ability to perform manual die attach for new design multi bar stacks, single emitter, and multi emitter chips and bars.
Monitor all manual die attach processes and provide technical support to help to resolve any issues.
Investigate and troubleshoot product deficiencies and failures.
Ability to perform package assembly for single emitter and multi-emitter packages
Perform and high magnification inspection for any defects that occur during reflow or assembly process.
Assist in defining and documenting newly introduced processes.
Use manual and automated wire-bonding systems to apply wire bonds to laser diode packages.
Ability to perform LIV test on high powered laser diodes at chip-on-submount and completed assembly levels.
Ability to accurately enter data into Manufacturing interfaces and Excel spreadsheets.
Ability to operate Coordinate Measuring Machine (CMM).
Ability to operate and program high-performance dicing saws.