Engineer/Principal Engineer RF Microwave Design (SkillBridge)

Northrop Grumman•Baltimore, MD

106d•$87,600 - $163,200•Onsite

About The Position

Northrop Grumman is seeking engineers with experience and interest in electronic assembly and packaging design through its SkillBridge Program. This program offers separating service members valuable civilian work experience during their last 6 months of service, for up to 180 days. Participants will work on-site, gaining experience in an entry to mid-level career path with on-the-job training for 40 hours per week. The goal is to provide job skills training in a professional setting, with the potential for conversion to a full-time opportunity. Service members will receive comprehensive hands-on experience, including professional development, networking, and training focused on leadership principles, company history, customer engagement, product overviews, and core job responsibilities. This program serves as a pipeline for motivated military candidates into Northrop Grumman.

Requirements

Has served at least 180 days on active duty
Is within 12 months of separation or retirement
Will receive an honorable discharge
Has taken any service TAPS/TGPS
Has attended or participated in an ethics brief within the last 12 months
Received Unit Commander (first O-4/Field Grade commander in chain of command) written authorization and approval to participate in SkillBridge Program prior to start of internship.
Electrical Engineering or related STEM field degree: Bachelor of Science with 2 years of RF/microwave experience; Masters degree with 0 years of RF/microwave experience. An additional 4 years of experience will be considered in lieu of a degree (for Engineer)
Electrical Engineering or related STEM field degree: Bachelor of Science with 5 years of RF/microwave experience; Masters degree with 3 years of RF/microwave experience; or PhD degree. an additional 4 years of experience will be considered in lieu of a degree (for Principal Engineer)
US Citizenship is required
Must have an Interim Secret Clearance Minimum Prior to start
Ability to use and apply technical standards, principles, theories, concepts and techniques to a broad variety of RF/Microwave design and test related problems of moderately complex difficulty. Solutions are imaginative, thorough, and practical, but work is still reviewed under general supervision. (for Engineer)
Developing proficiency in one or more areas of RF/Microwave discipline including but not limited to: RF components, assemblies, subsystems, requirements development, EM and related modeling & simulation, RF test verification, production test support, and design for producibility (for Engineer)
Exhibit entry-level proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (i.e. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA) (for Engineer)
General knowledge of electrical engineering, design software and equipment (for Engineer)
Ability to provide sound solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty. Solutions are imaginative, thorough, and practical. (for Principal Engineer)
Developing subject matter expertise in one or more areas of RF/Microwave discipline including but not limited to: RF components, assemblies, subsystems, requirements development, EM and related modeling & simulation, RF test verification, production test support, and design for producibility (for Principal Engineer)
Exhibit intermediate to expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (i.e. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA) (for Principal Engineer)
Proven knowledge of electrical engineering, design software and equipment (for Principal Engineer)

Nice To Haves

Top Secret / SCI security clearance

Responsibilities

Designing, modeling, and verifying RF/microwave, and mixed signal assemblies and subsystems
Utilize analysis, simulations and prototyping to develop antenna and signal conversion designs
Deriving and trading requirements with components, assembly and subsystem engineers
Performing electromagnetic simulation of component, assembly, and subsystem level performance
Managing RF budgets, frequency planning, and common assembly level interfaces
Predicting assembly level performance through selecting materials, components, and packaging approaches, RF chain analysis, electromagnetic simulation, data collection and analysis, and other modeling techniques
Develop custom RF integrated circuit designs to meet assembly and subsystem level requirements
Collaborating with peer functions such as Mechanical, Manufacturing, Quality, Supply Chain, and Test
Utilizing world class manufacturing capabilities both on-site and within the broader company for prototyping through full-rate production from the foundry level to microelectronic packaging to printed circuit board fabrication and assembly to subsystem level integration and test
Working directly with a wide variety of different external supplier partners including leading domestic foundries, printed circuit board fabricators and assemblers, component manufacturers, material fabricators, and more
Supporting products throughout the product life cycle (EMD, production, sustainment, DMS)
RF and mixed signal assembly product types include antenna radiators, circulators, device interposers, filters, manifolds, receiver / exciter assemblies, signal conditioning assemblies, signal generators, and transmit / receive assemblies
RF and mixed signal subsystem product types include antenna and receiver/exciter subsystems