Engineer - Metals Adv DRAM

Micron Technology • Boise, ID

3d • Onsite

About The Position

Develop new or modified process formulations, define processing or handling equipment requirements and specifications, and review processing techniques and methods applied in the manufacture, fabrication, and evaluation of products. Coordinate design requirement review with appropriate engineering/scientific personnel to ensure compatibility of processing methods. Compile and evaluate test data to determine appropriate limits and variables for process or material specifications. May conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes. Work directly with process integration and other process areas such as Dry Etch, Wet etch, CVD, Diffusion, Lithography & CMP. Work on state of the art and best in class metals chambers and own the process roadmap to meet program and yield goals. Understand solid-state physics including transition metal oxides, metals, surfaces, and interfaces. Understand fundamental challenges in materials exploration for device scaling. Understand chemical kinetics and their direct application to CVD, ALD, and PVD deposition processes in various deposition reactors.

Requirements

• Master’s degree in Materials Science, Physics, Chemistry, Chemical Engineering, Electrical Engineering, or related field and 3 years of experience in the job offered or in a related occupation OR a PhD degree in Materials Science, Physics, Chemistry, Chemical Engineering, Electrical Engineering, or related field
• Working with thin film deposition equipment in lab or clean-room environment
• Deposition processes (PVD, CVD or other techniques) and film characterization
• Thin film analysis and surface analysis techniques: SIMS, XPS, EDS, AFM, SEM, or other crystallographic techniques
• Materials physics, including the principles governing the structure, properties and electronic structure of advanced materials
• Material growth mechanisms: thin film deposition, crystallization and interfaces
• Electrical and physical analysis of semiconductor devices or nanostructures, device physics, and principles of electronic circuit design
• Scientific programming and scripting for data analysis and automation (Python, MATLAB, or JMP)

Responsibilities

• Develop new or modified process formulations
• Define processing or handling equipment requirements and specifications
• Review processing techniques and methods applied in the manufacture, fabrication, and evaluation of products
• Coordinate design requirement review with appropriate engineering/scientific personnel to ensure compatibility of processing methods
• Compile and evaluate test data to determine appropriate limits and variables for process or material specifications
• Conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes
• Work directly with process integration and other process areas such as Dry Etch, Wet etch, CVD, Diffusion, Lithography & CMP
• Work on state of the art and best in class metals chambers and own the process roadmap to meet program and yield goals
• Understand solid-state physics including transition metal oxides, metals, surfaces, and interfaces
• Understand fundamental challenges in materials exploration for device scaling
• Understand chemical kinetics and their direct application to CVD, ALD, and PVD deposition processes in various deposition reactors

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior