Engineer II-Layout (PCB Design)

Microchip Technology Inc.•Mount Holly Springs, PA

22h•Onsite

About The Position

Microchip is a leading innovator in the field of electronics design and manufacturing. We specialize in creating cutting-edge products for a variety of industries, including consumer electronics, automotive, aerospace, and medical devices. Our commitment to excellence has positioned us as a key player in the market, and we are now looking to expand our talented team. The Microchip Frequency and Timing Systems business unit is a world leader in precise time solutions and sets the world's standard for time. Our work produces, distributes, and applies precise time for the communications, aerospace/defense, IT infrastructure, and measurement industries. Our VOP group located in Mount Holly Springs, PA is a market leader specializing in Quartz Precision Oscillators and Frequency Control Solutions. We are seeking a skilled Signal Integrity PCB Design Engineer to join our dynamic engineering team. The ideal candidate will have a strong background in Signal Integrity and PCB design and layout, with a keen eye for detail and a passion for creating efficient, high-quality electronic circuits. This is an onsite position that will report to the Mount Holly Springs facility.

Requirements

Bachelor’s degree in electrical engineering, electronics technology, or a related field.
2.5 to 5 years’ experience in signal integrity and/or PCB design.
Proficiency in using PCB design software such as Xpedition, Altium Designer, or Cadence Allegro.
Experience with multi-layer high-speed digital, analog, and mixed-signal circuit layout design.
Experience with noise immunity using multi-layer ground planes.
Experience with signal isolation techniques.
Familiarity with IPC standards and guidelines.
Excellent communication and teamwork skills.
Ability to manage multiple projects and meet deadlines in a fast-paced environment.
Proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).

Nice To Haves

Experience with Ansys simulation software such as HFSS, Thermal, and Structural for PCB design.
Experience with RF design and analysis.
Experience with 3D CAD modeling for PCB integration into mechanical enclosures.
Knowledge of EMC/EMI best practices for PCB layout.
Experience with flexible and rigid-flex PCB designs.
Strong understanding of PCB manufacturing processes, materials, and their electrical, thermal, and environmental properties along with DFM (Design for Manufacturability) guidelines.

Responsibilities

Optimize mixed signal printed circuit board (PCBs) designs for signal integrity, manufacturability, and reliability.
Design and layout high-density multi-layer PCBs using industry-standard CAD tools.
Perform signal integrity analysis and simulations to identify and mitigate potential issues.
Collaborate with design engineers, process engineers, and other stakeholders to optimize PCB designs.
Conduct design reviews and provide feedback to ensure compliance with industry standards and best practices.
Generate and maintain design output documentation (i.e. gerber files, cad files, etc.) for PCB design files, BOMs, and assembly instructions.
Stay updated with the latest advancements in signal integrity and PCB design technologies.