Engineer I- Packaging

Microchip Technology Inc.Chandler, AZ
Onsite

About The Position

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc. People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence. Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you. Visit our careers page to see what exciting opportunities and company perks await!

Requirements

  • 0-3 years of professional experience.
  • Experience AutoCAD/Solid Works skill set (creation 3D models and 2D technical drawings)
  • Database management
  • Knowledgeable in Custom program coding
  • Knowledgeable on Geometric tolerancing
  • Experience MS Office skills (specially on MS Access)

Nice To Haves

  • Knowledgeable in Cadence/ANSYS Software is a plus
  • Knowledgeable in Auto LISP program is a plus

Responsibilities

  • Production of IC package outline drawings
  • Generation of Bonding Diagrams for manufacturing assembly
  • Database Management of IC assembly Bill of Materials (BOM)
  • Collaboration with multiple Business Units
  • Management of CPTD specification
  • Participate in other activities/tasks as assigned by CPTD

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What This Job Offers

Job Type

Full-time

Career Level

Entry Level

Education Level

No Education Listed

Number of Employees

5,001-10,000 employees

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