Eng Prin - Elec

BAE Systems•Dallas, TX

11d•Onsite

About The Position

We are seeking a mid-career Electrical Engineer to support our Dallas engineering team. If selected, you will be part of the Hardware Team supporting development of rugged commercial products along with full military compliant products. We have a small cohesive engineering team with all disciplines that allow the team to move fast while being part of the bigger BAE systems with all available resources that it has to offer.

Requirements

Bachelor’s degree in electrical engineering
Minimum of four years of relevant experience in related industry (i.e. defense, electronics) or two years with a master’s degree
Solid understanding of fundamentals of digital, analog, power, and mixed-signal electronics and interface/communication standards such as UART, SPI, QSPI, I2C, USB, Ethernet, ARINC 429, MIL-STD-1553, PCIe
Experience with the SOSA standard for 3U and 6U VPX module design.
PCB/CCA design experience for 3U or 6U VPX and other form factors.
Proficient at testing and troubleshooting analog, digital, and power supply-based circuits in a lab setting using oscilloscopes, bench supplies, vector network analyzers, spectrum analyzers, frequency counters, arbitrary waveform generators, function generators, logic analyzers
Ability to obtain a DoD Security Clearance – Secret

Nice To Haves

Master’s degree in electrical engineering, RF Engineering, or equivalent
Familiarity designing with FPGAs, System-On-Chips (SoC), and/or CPLDs using VHDL and/or Verilog
Familiarity designing and writing embedded SW for microcontroller-based systems and modules
Knowledge of system level EMI mitigation techniques along with proper grounding/shielding architecture
Experience with high-speed mixed signal HDI PCB design, constraints management, and proper routing for interfaces with lane rates up to 25Gbps
Understanding of SPICE simulators and simulation methods, preferably using LTSpice, TINA, PSpice
Experience with the following PCB and CCA design features: micro-via and blind/buried vias, stacked micro-vias, via-in-pad and via fill/cap processes, controlled impedances, back drilling, high pin count / fine-pitch BGAs, Chip-on-Board (COB), QFNs/DFNs, LGAs, and other advanced IC package types
Familiarity with Signal Integrity and Power Integrity, as it applies to proper layout techniques

Responsibilities

Translate system requirements into successful system architectures and complex printed board assembly designs.
Create board schematic and layouts using Cadence Allegro System Capture
Perform trade studies and prototyping to down select critical components, develop optimized electronic architectural solutions (SWAP), verify complex custom circuit blocks of an overarching system
Document design verification tests and design review documentation
Actively participate in knowledge-sharing culture via mentoring
Work within schedule and budget constraints and elevate concerns if challenges arise.

Benefits

health, dental, and vision insurance
health savings accounts
a 401(k) savings plan
disability coverage
life and accident insurance
employee assistance program
legal plan
discounts on things like home, auto, and pet insurance
paid time off
paid holidays
paid parental leave
military leave
bereavement leave
any applicable federal and state sick leave
company recognition program to receive monetary or non-monetary recognition awards