EMIB-T Substrate Program Integrator

Intel Corporation•Chandler, AZ

1d•$89,010 - $170,630•Onsite

About The Position

The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology Integration Group, you will play a critical role in enabling advanced packaging technology developments. In this position, you will lead EMIB-T substrate technology development and qualification activities, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams, suppliers, and assembly platform partners.

Requirements

Bachelor's degree with 6+ years of experience, OR Master's degree with 4+ years of experience, OR PhD with 2+ years of experience in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field.
Experience managing complex projects and deliver results in TD/high-volume manufacturing environments.

Nice To Haves

A strong foundation in advanced packaging, substrates, or semiconductor manufacturing.
Proven leadership in supplier management or technology enablement.
Ability to drive alignment and execution across global teams.
Proven ability to thrive in high-ambiguity environments and deliver results under pressure.
Knowledge of advanced packaging technologies and substrate/assembly manufacturing methodologies.
Familiarity with characterization techniques such as X-ray, SEM, FTIR, and EDX.
Experience with process flow development, FMEA, DOE design, and problem-solving tools.
Statistical tools and methods, including Statistical Process Control (SPC) for yield improvement.

Responsibilities

Lead EMIB-T substrate technology development and qualification activities.
Ensure suppliers achieve the required readiness to support growing customer demand.
Drive technical enablement.
Manage readiness milestones.
Collaborate closely with cross functional engineering teams, suppliers, and assembly platform partners.