Embedded Design Engineering Intern – Firmware

Leidos • Huntsville, AL

3d

About The Position

Leidos Defense Systems is seeking a talented Embedded Design Engineering Intern to join a diverse team to create unique solutions for complex problems. Leidos has offices across the United States that provide responsive, cost-effective engineering, scientific, and IT solutions in the defense, space, cyber, and commercial fields. The ideal candidate will thrive in a learning environment that encourages leadership and technical growth. Leidos' mission is to reach, equip, and teach students with an interest in the field of defense and aerospace. The internship program, running for over two decades, has been a staple at Leidos, giving interns hands-on experience in their future career path. This position is an Embedded Design Engineering Intern in the Electrical Systems Department. The selected candidate will have the opportunity to experience and learn about all phases of the product life cycle from concept development and detailed design through manufacturing, integration, testing, and post-delivery support. Additional learning opportunities related to digital-signal processing (DSP) design, printed circuit board (PCB) design, experience with technical trade studies, and evaluation of technology improvements will be provided to the engineering student through this internship.

Requirements

• Currently enrolled in an accredited college / university and currently working towards a degree in Computer Engineering or a related field.
• Experience with C, C++, or Rust embedded software programming through course work, lab projects, and previous internships.
• Demonstrates problem solving, teamwork, and communication skills.
• Holds a GPA of 3.0 or higher.
• Includes resume and unofficial transcripts in application.
• Must be a US Citizen and be able to obtain and maintain a DoD Secret security clearance.

Nice To Haves

• Utilizing modern Xilinx FPGA and SoC families and design tools (RFSoC, Xilinx IP Cores, AXI4, AXI-Stream)
• Basic knowledge of FPGA/Firmware languages (VHDL, Verilog, SystemVerilog, assembly, Rust)
• Experience with simulation and test frameworks
• RISC microprocessors architectures (ARM Cortex, Microblaze, PowerPC, RISC-V)
• Memory architectures, types, and caching
• GNU/Linux and developing kernel drivers
• Communication protocols such as: UART, Ethernet, SPI, I2C, CAN bus, etc.
• Embedded operating systems (Linux, VxWorks, Integrity, FreeRTOS, Zephyr, uC/OS-II)
• Electronics and PCBA design
• Leading design teams including technical leadership, budgeting, and scheduling

Responsibilities

• Designing embedded software and firmware
• Performing HDL simulations and software unit tests
• Hands-on laboratory testing with instrumentation, test equipment, and debug/test methods
• Performing in a collaborative engineering environment working closely with multi-disciplinary teams
• Working with platforms such as FPGAs, microcontrollers, microprocessors, and mixed signal designs.

What This Job Offers

• Career Level: Intern
• Education Level: No Education Listed