Electronics Manufacturing Engineer

Johns Hopkins Applied Physics Laboratory•Laurel, MD

About The Position

The Electronics Manufacturing Engineer helps engineer, design, and build electronic circuit assemblies for space and national security applications. The role supports advanced prototypes and one-of-a-kind systems, developing and implementing processes that improve the speed and reliability of surface mount technology (SMT) and mixed-technology assemblies in a high-mix, low-volume facility. The engineer interfaces with electrical and mechanical engineers across the Laboratory, develops process plans and technical capabilities, and leads hands-on hardware development through the surface-mount electronics fabrication area. The position also translates complex electrical schematics into functional, reliable, manufacturable PCB layouts and serves as the manufacturing expert for teams designing and fabricating complex electronic assemblies for critical national programs. The role includes responsibility for manufacturing outcomes in an assigned subsystem, process development and improvement, technician guidance, equipment programming and maintenance support, PCB layout and routing, manufacturing documentation, and participation in cross-functional design reviews. Work takes place in a Class 8 cleanroom, with up to 5% U.S. travel during certain periods and occasional shifted work hours during heavy workloads. Candidates must be able to obtain a Secret security clearance and meet eligibility requirements, including U.S. citizenship.

Requirements

Bachelor's degree or equivalent in a technical field, such as electrical, mechanical, or industrial engineering, or equivalent experience.
At least 3 years of increasingly responsible work in an electronics manufacturing environment, particularly in a high-mix, low-volume SMT facility.
At least 3 years of experience in rigid, flex, or rigid-flex PCB layout design.
Experience designing 4- to 12+-layer boards with controlled impedance.
Experience with blind and buried vias and fine-pitch BGA component breakout.
Basic understanding of signal integrity, power integrity, and EMI/EMC mitigation techniques.
Excellent written and verbal communication skills.
Ability to work collaboratively with partners.
Proven process development and improvement skills, with knowledge of solder joint characteristics and SMT processing tools and materials.
Ability to manage multiple tasks simultaneously.
Willingness to learn and improve personally and improve processes.
Willingness and ability to work in a Class 8 cleanroom and travel within the United States for up to 5% of the time during certain periods for vendor evaluations, in-process inspections, and design reviews.
Flexibility in work hours during occasional periods of heavy workload; shifted hours, including some evenings or weekends, may be required for short periods.
Ability to obtain a Secret security clearance; eligibility requirements include U.S. citizenship.

Nice To Haves

Experience building electronic hardware for spacecraft.
Experience with IPC J-STD-001FS.
Knowledge of statistical process control (SPC) and design of experiments (DOE).
Exposure to manufacturing resource planning (MRP) and computer-aided manufacturing (CAM) systems.
Experience using Altium Designer or Siemens Xpedition Enterprise.
Basic programming skills.
Active Secret security clearance.

Responsibilities

Serve as the manufacturing expert on teams designing and fabricating complex electronic assemblies for critical national programs, with responsibility for manufacturing outcomes in an assigned subsystem.
Perform analyses to help ensure hardware meets sponsor requirements; recommend materials and processes to improve performance, quality, cost, and schedule; and evaluate and work with vendors as needed.
Generate, review, and revise standard operating procedures, work instructions, and process plans.
Develop, implement, and improve processes for fabricating complex, high-reliability electronic assemblies.
Guide and develop fabrication technicians in electronic assembly areas.
Program or develop process parameters for automated electronic assembly tools and equipment, and maintain or assist with the maintenance, calibration, and repair of those tools and equipment.
Create multilayer PCB layouts, component placement, and high-density interconnect trace routing using Altium Designer and Xpedition.
Define and manage electrical constraints for high-speed signals, impedance control, differential pairs, and power delivery networks.
Collaborate with manufacturing partners and mechanical engineers to optimize designs for fabrication and assembly.
Generate manufacturing documentation, drill drawings, assembly drawings, and bills of materials.
Present layouts during cross-functional design reviews with hardware, mechanical, and thermal engineers.
Interface with electrical and mechanical engineers, develop process plans and technical capabilities, and lead hands-on hardware development through the surface-mount electronics fabrication area.