ElectroMechanical Engineer

Lockheed Martin•Orlando, FL

2d•Onsite

About The Position

As the Electromechanical Design Engineer, you will develop innovative electromechanical concepts, generate production-ready documentation, and provide hands-on support throughout the build-to-field process. You will work independently when needed and collaborate closely with a wide range of specialists to keep designs on schedule and compliant. This role is for the Missiles & Fire Control (MFC) Carrier Card Assembly (CCA) team, which creates the mechanical electrical hardware that powers advanced missile systems and supports production line delivery for U.S. and allied defense programs.

Requirements

Bachelors degree from an accredited college in a related discipline, or equivalent experience/combined education, with 5 years of professional experience; or 3 years of professional experience with a related Masters degree.
Knowledge of CREO and Windchill
Must be able to obtain a security clearance
Experience creating and releasing drawings through Windchill
Must be able to work onsite
Must be a U.S. Citizen

Nice To Haves

Zuken Knowledge
Knowledge of Design Assurance Review
Experience working in Defense
Knowledgeable in microelectronics Design and fabrication

Responsibilities

Designing and detailing electromechanical systems and CCA components, including material, component, and process selection.
Creating 3D layouts, 2D drawings, and all required engineering deliverables in Windchill.
Coordinating with structural, thermal, configuration management, electrical, mechanical, subcontractor, planning, and quality teams to ensure holistic design integration.
Supporting design reviews, documentation releases, assembly, inspection, and test activities with technical expertise.
Managing Manufacturing Review Board (MRB) actions, tracking issues, and driving corrective actions.
Conducting risk-based decisions and influencing stakeholders without direct authority.
Traveling to customer, supplier, or production sites as required to resolve technical challenges and support program milestones.