Electromechanical Design Engineer

Nesco Resource•Orlando, FL

About The Position

The Electro Mechanical Engineer will join the Hardware Engineering team at Missiles and Fire Control (MFC), which develops precision-engagement aerospace and defense systems and electrical hardware for missiles, sensors, and other mission-critical subsystems. The engineer will own package hardware design, heat transfer and thermal dissipation, structural integrity, and mechanical survivability of completed 3DHI packages throughout their operational lifespans. The role involves designing multichip package devices and advanced circuit-card packages; integrating thermal-management systems; developing and validating electromechanical systems; and analyzing thermal, electrical, and mechanical performance. The engineer will also lead qualification and failure-analysis activities, coordinate cross-functional engineering and production teams, and manage project risks, schedules, costs, and earned-value metrics. Nesco Resource offers associates a benefits package that includes a Minimum Essential Coverage plan encompassing medical, vision, dental, 401(k), and Employee Assistance Program services. The employer states that it provides equal employment opportunities and prohibits discrimination and harassment on legally protected grounds.

Requirements

Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university, or at least 15 years of professional experience in Electromechanical Engineering or a related discipline without a degree.
At least 11 years of experience with 3D Heterogeneous Integration (3DHI).
At least 11 years of experience with advanced packaging.
At least 11 years of technical or project leadership experience supporting production of high-reliability electronics products.
At least 11 years of experience with microelectronics design.
Proficiency in CREO modeling and electromechanical system design.
Project leadership or management experience across the engineering and production lifecycle, including scoping, sizing, cost estimation, planning, scheduling, staffing, tracking, and earned-value management (EVM).
Experience in presentations and oral and written communication to facilitate effective exchanges with coworkers, leaders, and customers.
Experience working with cross-functional teams across multiple locations.
Experience capturing flowed and derived requirements for electromechanical designs.

Nice To Haves

Master's degree or PhD.

Responsibilities

Design multichip package devices, including package substrates, integrated heat spreaders and attachment mechanisms, stiffeners, and thermal-management system integration.
Collaborate with mechanical and electrical engineering analysts to develop finite element analysis models and multiphysics simulations for thermal cycling and reliability, power integrity and electrical performance, and mechanical stress, including operational shock and vibration.
Define and execute packaging qualification plans in accordance with project requirements and JEDEC and MIL-SPEC standards, including Highly Accelerated Stress Testing (HAST).
Investigate component-interface and intermetallic-connection failures, such as cracked solder joints, delaminated layers, and warped package substrates; implement corrective actions and incorporate findings into product revisions and lessons learned.
Architect, design, and validate advanced circuit-card packages.
Design high-density circuit cards, cable assemblies, and interconnect solutions that meet size, weight, power, security, and performance constraints.
Design and develop electromechanical systems for advanced, special, and IRAD programs, including printed wiring boards, circuit/electronic card assemblies, harness assemblies, and subassemblies.
Lead and document design assurance reviews, track issues, and drive corrective actions to closure.
Perform thermal, signal-integrity, and electromagnetic-compatibility analyses for operation in harsh DoD environments.
Coordinate with systems, hardware, software, test, and supply-chain teams to deliver results on schedule and within budget.
Manage risk, schedule, and earned-value metrics, and report status to senior leadership.