ElectroMechanical Design Engineer Sr.

Lockheed Martin•Orlando, FL

22h•Hybrid

About The Position

You will be the Electromechanical Design Engineer for the Missile & Radar Electronics Packaging team. Our team delivers rugged enclosures, chassis, cold plates, card guides, wedge locks, and interconnect assemblies that enable high performance missile and radar hardware to operate reliably in demanding environments. As the Electromechanical Design Engineer you will create and mature the mechanical and thermal solutions that marry the electronics to their protective structures. You’ll partner with circuit card designers, suppliers, and manufacturing partners to turn concepts into production ready hardware.

Requirements

Bachelor's degree from an accredited college in a related discipline (Mechanical, Electromechanical, or Electrical Engineering), or equivalent experience/combined education, with 5 years of professional experience; or 3 years of professional experience with a related Master's degree.
Experience with PTC Creo (or equivalent 3D CAD) for electromechanical packaging and harness design.
Experience with a Product Data Management / Product Lifecycle tool (Windchill or equivalent).
Experience applying GD&T (Geometric Dimensioning and Tolerancing) per ASME Y14.5.
Experience coordinating with circuit design engineers on CCA / printed wiring board packaging.
Excellent communication and interpersonal skills; ability to work cross-functionally across electrical, mechanical, systems, and manufacturing disciplines.
MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access.
The selected candidate must be able to obtain a secret clearance.

Nice To Haves

Experience designing electronics packaging for missile, radar, or flight termination systems.
Experience with electronics, machined components, test equipment, cable assemblies, and circuit cards.
Experience with Windchill PDM and Technical Data Package generation (BOM, 2D drawings, 3D modeling).
Experience with military and aerospace specifications (MIL-STD-810, MIL-STD-461, MIL-DTL-38999).
Working knowledge of Zuken or similar electrical CAD.
Experience with flex circuit design.
Experience with Design Assurance processes and MRB authority.

Responsibilities

Developing detailed 3 D models and 2 D drawings in PTC Creo (ASME Y14.5/GD&T) and maintaining configuration control in Windchill (PDM/PLM).
Coordinating with circuit card designers to verify that CCA form factors, component heights, and connector placements fit the mechanical chassis and thermal solution.
Selecting materials, components, and manufacturing processes that satisfy size, weight, power, cost, and environmental constraints (e.g., MIL STD 810, MIL STD 461).
Performing and reviewing thermal, structural (FEA), vibration, shock, and EMI analyses; driving design changes when analysis or test reveals margin issues.
Designing wire harness and cable assemblies (MIL DTL 38999, D sub, micro D, etc.) with proper routing, shielding, grounding, and strain relief.
Defining acceptance test criteria, supporting qualification and environmental testing, and diagnosing root causes of structural, thermal, or electrical interface problems.
Generating and maintaining Bills of Materials in Windchill; coordinating builds with internal shops and external suppliers; supporting production, MRB, and quality activities.
Providing technical guidance and mentorship to junior engineers; contributing to technical reviews, IRAD projects, and proposal basis of estimate development.
Upholding configuration control and design documentation in Lockheed Martin PLM tools; supporting prototype fabrication, assembly, inspection, and lab testing.