Electrical Engineer (Mid-Level)

Boeing•Heath, OH

6d•Onsite

About The Position

The Boeing Defense, Space & Security (BDS) team is seeking an Electrical Engineer (Mid-Level) located in Heath (Columbus), OH. Boeing Defense and Space Systems is growing in the area of aircraft, missile, weapons, and autonomous system Guidance Navigation and Control (GN&C) system design, development, integration, and test. The InterContinental Ballistic Missile (ICBM) Minuteman III Guidance Subsystem Support Contract (GuSSC) Sustainment Engineering program is looking for motivated, talented engineers to join the Boeing team in this exciting business area. The selected Associate Electrical Engineer product responsibilities will include engineering execution of sustainment efforts supported by the local Heath, (Columbus) OH team. Support will include execution of the Program Work Structure (PWS), including schematic design, electrical component obsolescence studies, and circuit modeling in support of the local Heath team.

Requirements

Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
5+ years of related work experience and a bachelor’s degree or an equivalent combination of related work experience and technical education
Must meet U.S. export control compliance requirements. To meet U.S. export control compliance requirements, a “U.S. Person” as defined by 22 C.F.R. §120.62 is required. “U.S. Person” includes U.S. Citizen, U.S. National, lawful permanent resident, refugee, or asylee.
Requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim and/or final U.S. Secret Clearance Post-Start is required.

Nice To Haves

Experience working with USAF or other DoD agencies
Experience with creation, change, and design of electromechanical assemblies
Experience with analog and digital design, manufacturing, and sustainment
Experience engineering for obsolescence and sustainment

Responsibilities

Collect, organize, synthesize, and analyze data; summarize findings; develop conclusions and recommendations from appropriate data sources.
Apply advanced knowledge of design concepts and techniques (e.g., concurrent engineering, Design for Manufacture/Assembly [DFM/A]).
Understand responsibilities and tasks performed by various engineering departments/disciplines (e.g., design, test, software, technology, avionics).
Understand the interaction between departments/disciplines and how their products/processes affect one another and impact non-engineering processes (e.g., Operations, Logistics, Business).
Communicate with technical personnel from multiple skill areas and functions to evaluate technical information and issues impacting design, production, and support of products, services, or other deliverables.
Understand the big picture and the inter-relationships of all positions and activities in the system, including the impact of changes in one area on another area. This includes the ability to see and understand the inter-relationships between components of systems and plans, anticipate future events, and apply the principles of systems thinking to accelerate performance.
Apply knowledge of worst case circuit characteristics (e.g., electrical and electronic component tolerances, frequency, voltage, aging, drift) analysis principles.
Apply knowledge of circuit stress analysis, including electrical and electronic components, circuit design and schematics, and circuit loads (e.g., power, current, thermal and voltage).
Apply knowledge of circuit design tools (e.g., Spice, Mentor Graphics, Hardware Description Language [HDL]).
Apply knowledge of analog and digital circuit design and packaging techniques.
Apply knowledge of mechanical and/or electrical design techniques (e.g., enclosure design, electronic equipment installation design, wire harness design).
Apply knowledge of specialized electromechanical design (e.g., space environment, high density interconnects, high frequency electronics, photonics, EMI/EMC/ESD, analog/digital electronics).
Utilize computer aided design tools and systems (e.g., AutoCAD, CATIA, Mentor, Unigraphics).
Apply analysis techniques (e.g., thermal, structural, high-speed digital, impedence control).